1140-101K pdf Datasheet P2 Part Num --- IC-ON-LINE


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1140-101K Datasheet PDF File

For 1140-101K Found Datasheets File :: 150+ Page :: | 1 | <2> | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |

					Digital Equipment
Part No.	21140
Description	DEC Chip
File Size	1,461.58K / 43 Page	View it Online	Download Datasheet

						Murata Manufacturing Co Ltd
Part No.	DE6B3KJ101KA4BE01J
Description	Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive
Tech specs				Official Product Page

HUA FENG CIRCUIT

					Molex Electronics Ltd.
Part No.	1140-4126
Description	Barrel Form Punch
File Size	11.60K / 1 Page	View it Online	Download Datasheet

						Murata Manufacturing Co Ltd
Part No.	DE6B3KJ101KN4AE01J
Description	Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	1140-4018
Description	Conductor Punch
File Size	14.32K / 1 Page	View it Online	Download Datasheet

						Murata Manufacturing Co Ltd
Part No.	DE6B3KJ101KB4BE01J
Description	Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	1140-4028
Description	Insulation Punch
File Size	11.51K / 1 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	1140084168
Description	1140084168-Micro SD Normal Open H=1.55 NONE PUSH
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	1140-4027
Description	Conductor Punch
File Size	14.44K / 1 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	10119332-101K03LF
Description	BergStik®, Board to Board connector, Unshrouded Right Angle Header, Surface Mount, Single row , 3 Positions, 2.54mm (0.100in) Pitch , With Peg
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	1140-4129
Description	Barrel Form Punch
File Size	11.51K / 1 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	G88MP08101KEU
Description	Micro Power Plus 3.0 Connector System - G88MP Series, Wire to Board connector, Vertical, Dual row, 3.0mm pitch, 8 positions, 100u\\ Tin, 3.20mm tail length, LCP, Natural , TRAY
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	1140-4031
Description	Conductor Punch
File Size	14.29K / 1 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	10119333-101K04LF
Description	BergStik®, Board to Board connector, Unshrouded Right Angle Header, Surface Mount, Single row , 4 Positions, 2.54mm (0.100in) Pitch
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	1140-4032
Description	Insulation Punch
File Size	14.44K / 1 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	10145891-0101K13LF
Description	DDR4 Memory Module Sockets, Storage and Server System, Surface Mount, 288 Positions, 0.85mm (0.033in) Pitch.
Tech specs				Official Product Page

					Toshiba Semiconductor
Part No.	D1140
Description	Search --To 2SD1140
File Size	224.30K / 4 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	95278-101K12LF
Description	BergStik, Board to Board connector, 2.54mm (0.100in), Unshrouded vertical Header, Surface Mount, Double Row, 12 Positions.
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	11-40-2151 1140-2151 0011-40-2151
Description	Terminator Die
File Size	19.99K / 1 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	G88MP22101KEU
Description	Micro Power Plus 3.0 Connector System - G88MP Series, Wire to Board connector, Vertical, Dual row, 3.0mm pitch, 22 positions, 100u\\ Tin, 3.20mm tail length, LCP, Natural , TRAY
Tech specs				Official Product Page

For 1140-101K Found Datasheets File :: 150+ Page :: | 1 | <2> | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |

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