|
|
|
Texas Instruments |
Part No. |
HPA00194DGNR
|
Description |
1.25-W Mono, Fully Differential, Class-AB Audio Amplifier 8-MSOP-PowerPAD -40 to 85
|
Tech specs |
|
|
|
Official Product Page
|
|
|
|
Texas Instruments |
Part No. |
CD40194BE
|
Description |
CMOS 4-Bit Bidirectional Universal Shift Register 16-PDIP -55 to 125
|
Tech specs |
|
|
|
Official Product Page
|
|
|
|
Amphenol Communications Solutions |
Part No. |
131-3518-21H
|
Description |
Paladin® 112Gb/s Backplane Connector, 3-Pair, 8 Column, Left Polarized, Backplane Module, 2.25mm Wipe, APP.
|
Tech specs |
|
|
|
Official Product Page
|
|
|
|
Amphenol Communications Solutions |
Part No. |
77313-518-22LF
|
Description |
BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 22 Positions
|
Tech specs |
|
|
|
Official Product Page
|
|
|
|
Amphenol Communications Solutions |
Part No. |
77313-518-20LF
|
Description |
BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 20 Positions
|
Tech specs |
|
|
|
Official Product Page
|
|
|
|
Amphenol Communications Solutions |
Part No. |
77313-518-24LF
|
Description |
BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 24 Positions
|
Tech specs |
|
|
|
Official Product Page
|
|
|
|
Amphenol Communications Solutions |
Part No. |
77313-518-28LF
|
Description |
BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 26 Positions
|
Tech specs |
|
|
|
Official Product Page
|
|
|
|
Amphenol Communications Solutions |
Part No. |
131-3518-21D
|
Description |
Paladin® 112Gb/s Backplane Connector, 3-Pair, 8 Column, Left Polarized, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
|
Tech specs |
|
|
|
Official Product Page
|
|
|
|
Molex Electronics Ltd.
|
Part No. |
14-60-0203 A-70400-0194
|
Description |
2.54mm (.100) Pitch SL?/a> Insulation Displacement Connector Assembly, Female, Single Row, Version A, Nonpolarized, Wire Size 26, 3.81μm (150μ) Tin/Lead (SnPb) 2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Female, Single Row, Version A, Nonpolarized, Wire Size 26, 3.81μm (150μ) Tin/Lead (SnPb)
|
File Size |
150.24K /
3 Page |
View
it Online |
Download Datasheet |
|
|
|
Amphenol Communications Solutions |
Part No. |
77313-518-26LF
|
Description |
BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 26 Positions
|
Tech specs |
|
|
|
Official Product Page
|
|
Bom2Buy.com
Price and Availability
|