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  51163-1300 Datasheet PDF File

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    51163-1500

Molex Electronics Ltd.
Part No. 51163-1500
Description 2.50mm Pitch Wire-to-Board Receptacle Housing, Positive Lock, with Retainer, 15
File Size 28.44K  /  1 Page

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Rochester Electronics LLC
Part No. BLA1011-300
Description BLA1011-300 - 300W LDMOS Avionics Power Transistor
Tech specs 　 　

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HUA FENG CIRCUIT





    51163-1000

Molex Electronics Ltd.
Part No. 51163-1000
Description 2.50mm Pitch Wire-to-Board Receptacle Housing, Positive Lock, with Retainer, 10
File Size 28.44K  /  1 Page

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Toshiba Electronic Devices & Storage Corporation
Part No. XPN1300ANC
Description N-ch MOSFET, 100 V, 30 A, 0.0133 Ω@10V, TSON Advance(WF)
Tech specs 　 　

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    51163-0400

Molex Electronics Ltd.
Part No. 51163-0400
Description 2.50mm Pitch Wire-to-Board Receptacle Housing, Positive Lock, with Retainer, 4
File Size 28.43K  /  1 Page

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Texas Instruments
Part No. TPS51163DRCT
Description 4.5V to 13.2V Synchronous Buck Controller with High Current Gate Driver, 600kHz 10-VSON -40 to 85
Tech specs 　 　

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    51163-1100

Molex Electronics Ltd.
Part No. 51163-1100
Description 2.50mm (.098) Pitch Wire-to-Board Receptacle Housing, Positive Lock, With Retainer11 Circuits
File Size 280.08K  /  5 Page

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Texas Instruments
Part No. TPS51163DRCR
Description 4.5V to 13.2V Synchronous Buck Controller with High Current Gate Driver, 600kHz 10-VSON -40 to 85
Tech specs 　 　

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    EEPROM
NIC Components, Corp.
PLX Technology, Inc.
Part No. UHR-5/4000-D48 UHR-12/1650-D48 UHR-12/1650-D12 UHR-3.3/4850-D48 UHR-3.3/4850-D12 UHR-15/1300-D48 UHR-15/1300-D12 UHR-5/4000-D12
Description 16 Kbit, 8 Kbit, 4 Kbit, 2 Kbit and 1 Kbit serial I²C bus EEPROM
512 Kbit and 256 Kbit serial I²C bus EEPROM with three Chip Enable lines
512 Kbit and 256 Kbit serial I&#178;C bus EEPROM with three Chip Enable lines 型DC - DC电压转换
16 Kbit, 8 Kbit, 4 Kbit, 2 Kbit and 1 Kbit serial I&#178;C bus EEPROM 型DC - DC电压转换
File Size 462.36K  /  4 Page

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Amphenol Communications Solutions
Part No. 54112-801300800LF
Description BERGSTIK STACKING
Tech specs 　 　

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    K4X51163PC-FE K4X51163PC-LE

Samsung semiconductor
Part No. K4X51163PC-FE K4X51163PC-LE
Description 32M x16 Mobile-DDR SDRAM
File Size 257.81K  /  23 Page

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Amphenol Communications Solutions
Part No. 92813-007LF
Description Minitek® 2.00mm, Board to Board, Unshrouded Vertical Stacking Header, Surface Mount, Double Row, 40 Positions, 2.00mm (0.079in) Pitch..
Tech specs 　 　

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    51163-1400 0511631400

Molex Electronics Ltd.
Part No. 51163-1400 0511631400
Description 2.50mm (.098) Pitch Wire-to-Board Receptacle Housing, Positive Lock, With Retainer14 Circuits
File Size 280.08K  /  5 Page

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Amphenol Communications Solutions
Part No. 92813-005LF
Description Minitek® 2.00mm, Board to Board, Unshrouded Vertical Stacking Header, Surface Mount, Double Row, 16 Positions, 2.00mm (0.079in) Pitch..
Tech specs 　 　

Official Product Page

    90635-1163 0906351163

Molex Electronics Ltd.
Part No. 90635-1163 0906351163
Description 1.27mm (.050) Pitch QF-50, Single Beam, Vertical MIL/DIN Version, 0.38μm (15u) Gold (Au)
File Size 219.16K  /  4 Page

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Amphenol Communications Solutions
Part No. 10061913-003CLF
Description PCI Express® GEN 3 Card Edge, Storage and Server Connector, Vertical, Surface Mount, x16, 164 Positions, 1.00mm (0.039in) Pitch
Tech specs 　 　

Official Product Page

    K4X51163PE-FG

Samsung semiconductor
Part No. K4X51163PE-FG
Description 32Mx16 Mobile DDR SDRAM
File Size 348.12K  /  20 Page

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Amphenol Communications Solutions
Part No. 54121-112021300LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 2 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

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    K4H511638G

Samsung semiconductor
Part No. K4H511638G
Description 512Mb G-die DDR SDRAM Specification
File Size 394.04K  /  24 Page

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Amphenol Communications Solutions
Part No. 54121-407031300LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 3 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

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