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  63444-0805 Datasheet PDF File

For 63444-0805 Found Datasheets File :: 150+       Page :: | 1 | <2> | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    63444-1909

Molex Electronics Ltd.
Part No. 63444-1909
Description Punch

File Size 25.09K  /  1 Page

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Amphenol Communications Solutions

Part No. 63444-001TC
Description Minitek® 2.00mm, Board to Board, Unshrouded Vertical Stacking Header, Surface Mount, Double Row, 50 Positions, 2.00mm (0.079in) Pitch..
Tech specs    

Official Product Page

HUA FENG CIRCUIT





   
Part No. 63444-004LF
Description 32 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SURFACE MOUNT

File Size 148.93K  /  3 Page

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Amphenol Communications Solutions

Part No. 63444-006TCLF
Description Minitek® 2.00mm, Board to Board, Unshrouded Vertical Stacking Header, Surface Mount, Double Row, 16 Positions, 2.00mm (0.079in) Pitch..
Tech specs    

Official Product Page

    63861-4170 63861-4100 63444-1302

Molex Electronics Ltd.
Part No. 63861-4170 63861-4100 63444-1302
Description Punch

File Size 26.31K  /  1 Page

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Amphenol Communications Solutions

Part No. 63444-006TC
Description Minitek® 2.00mm, Board to Board, Unshrouded Vertical Stacking Header, Surface Mount, Double Row, 16 Positions, 2.00mm (0.079in) Pitch..
Tech specs    

Official Product Page

    63860-3000 63860-3070 63860-3100 63860-3170 63444-1905

Molex Electronics Ltd.
Part No. 63860-3000 63860-3070 63860-3100 63860-3170 63444-1905
Description Punch

File Size 28.56K  /  1 Page

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Amphenol Communications Solutions

Part No. 63444-003TCLF
Description Minitek® 2.00mm, Board to Board, Unshrouded Vertical Stacking Header, Surface Mount, Double Row, 16 Positions, 2.00mm (0.079in) Pitch..
Tech specs    

Official Product Page

    0634441425

Molex Electronics Ltd.
Part No. 0634441425
Description Application Tooling

File Size 18.27K  /  1 Page

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Amphenol Communications Solutions

Part No. 92634-448HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 48 Positions, 2.54 mm Pitch, Right Angle, 8.08 mm (0.318in) Mating, 8.08 mm (0.318in) Tail.
Tech specs    

Official Product Page

   
Part No. 0805
Description From old datasheet system

File Size 67.91K  /  3 Page

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Amphenol Communications Solutions

Part No. 92634-446HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 46 Positions, 2.54 mm Pitch, Right Angle, 8.08 mm (0.318in) Mating, 8.08 mm (0.318in) Tail.
Tech specs    

Official Product Page

    美丽微半导体有限公司
缇?附寰??瀵间???????
Part No. 0805-T
Description Case No. 0805 Device

File Size 60.42K  /  1 Page

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Amphenol Communications Solutions

Part No. 92634-444HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 44 Positions, 2.54 mm Pitch, Right Angle, 8.08 mm (0.318in) Mating, 8.08 mm (0.318in) Tail.
Tech specs    

Official Product Page

    0805-T 0805

FORMOSA[Formosa MS]
Part No. 0805-T 0805
Description Case No. 0805 Device

File Size 56.61K  /  1 Page

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Amphenol Communications Solutions

Part No. 92634-440HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 40 Positions, 2.54 mm Pitch, Right Angle, 8.08 mm (0.318in) Mating, 8.08 mm (0.318in) Tail.
Tech specs    

Official Product Page

    Vishay
Part No. IFC-0805
Description High Q/SRF Film Inductor

File Size 103.21K  /  1 Page

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Amphenol Communications Solutions

Part No. 92634-442HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 42 Positions, 2.54 mm Pitch, Right Angle, 8.08 mm (0.318in) Mating, 8.08 mm (0.318in) Tail.
Tech specs    

Official Product Page

    LSW-0805

ETC
Part No. LSW-0805
Description Wound Chip Inductor

File Size 52.31K  /  1 Page

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Amphenol Communications Solutions

Part No. G832MB110805022HR
Description 0.80mm Board-to-Board 85Ω Connector, Pitch 0.8mm, Height 7.7 mm, 80 Positions, Dual Row, BTB Vertical Plug SMT, Gold Flash Black.
Tech specs    

Official Product Page

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