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  70287-1011 Datasheet PDF File

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    70287-1086

Molex Electronics Ltd.
Part No. 70287-1086
Description 2.54mm (.100) Pitch C-Grid? Header, Breakaway, Dual Row, Vertical, with RetentionPin, 78 Circuits, 8.13mm (.320) Mating Pin Length, Tin (Sn) Plating
File Size 303.42K  /  5 Page

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Amphenol Communications Solutions
Part No. 10118085-101-12LF
Description Unshrouded Right Angle header,Surface Mount, Double Row, 12 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    70287-1222

Molex Electronics Ltd.
Part No. 70287-1222
Description 2.54mm (.100) Pitch C-Grid Header, Breakaway, Dual Row, Vertical, with Retention Pin, 56 Circuits, 6.10mm
File Size 308.37K  /  6 Page

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Amphenol Communications Solutions
Part No. 10119333-101-15LF
Description BergStik®, Board to Board connector, Unshrouded horizontal header, Surface mount, Single Row, 15 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    70287-1164

Molex Electronics Ltd.
Part No. 70287-1164
Description 2.54mm (.100) Pitch C-Grid? Header, Breakaway, Dual Row, Vertical, with RetentionPin, 38 Circuits, 8.13mm (.320) Mating Pin Length, 0.38μm (15μ) Gold (Au) Selective
File Size 303.44K  /  5 Page

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Amphenol Communications Solutions
Part No. 10114829-10110LF
Description 1.25mm Wire to Board Wafer, Vertical, Through Hole, 10 Positions
Tech specs 　 　

Official Product Page

    70287-1250

Molex Electronics Ltd.
Part No. 70287-1250
Description 2.54mm (.100) Pitch C-Grid? Header, Breakaway, Dual Row, Vertical, with RetentionPin, 14 Circuits, 8.13mm (.320) Mating Pin Length, 0.76μm (30μ) Gold (Au) Selective
File Size 303.46K  /  5 Page

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Amphenol Communications Solutions
Part No. 10114831-10113LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 13 POSITIONS, TIN PLATING
Tech specs 　 　

Official Product Page

    70287-1223

Molex Electronics Ltd.
Part No. 70287-1223
Description 2.54mm (.100) Pitch C-Grid? Header, Breakaway, Dual Row, Vertical, with RetentionPin, 58 Circuits, 6.10mm (.240) Mating Pin Length, 0.76μm (30μ) Gold (Au) Selective
File Size 308.37K  /  6 Page

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Amphenol Communications Solutions
Part No. 10114831-10114LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 14 POSITIONS, TIN PLATING
Tech specs 　 　

Official Product Page

    70287-1224

Molex Electronics Ltd.
Part No. 70287-1224
Description 2.54mm (.100) Pitch C-Grid? Header, Breakaway, Dual Row, Vertical, with RetentionPin, 60 Circuits, 6.10mm (.240) Mating Pin Length, 0.76μm (30μ) Gold (Au) Selective
File Size 308.36K  /  6 Page

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Amphenol Communications Solutions
Part No. 10114829-10114LF
Description 1.25mm Wire to Board Wafer, Vertical, Through Hole, 14 Positions
Tech specs 　 　

Official Product Page

    70287-1088

Molex Electronics Ltd.
Part No. 70287-1088
Description 2.54mm (.100) Pitch C-Grid? Header, Breakaway, Dual Row, Vertical, with Retention Pin, 82 Circuits, 8.13mm (.320) Mating Pin Length, Tin (Sn) Plating
File Size 303.29K  /  5 Page

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Amphenol Communications Solutions
Part No. 10114828-10115LF
Description 1.25mm Wire to Board Wafer,Vertical, Surface Mount, 15 Positions
Tech specs 　 　

Official Product Page

    70287-1197

Molex Electronics Ltd.
Part No. 70287-1197
Description 2.54mm (.100) Pitch C-Grid Header, Breakaway, Dual Row, Vertical, with Retention Pin, 6 Circuits, 6.10mm
File Size 308.35K  /  6 Page

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Amphenol Communications Solutions
Part No. 10114830-10111LF
Description 1.25mm Wire to Board Wafer, Right Angle, Surface Mount, 11 Positions
Tech specs 　 　

Official Product Page

    70287-1082

Molex Electronics Ltd.
Part No. 70287-1082
Description 2.54mm (.100) Pitch C-Grid? Header, Breakaway, Dual Row, Vertical, with RetentionPin, 70 Circuits, 8.13mm (.320) Mating Pin Length, Tin (Sn) Plating
File Size 303.42K  /  5 Page

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Amphenol Communications Solutions
Part No. 10114829-10115LF
Description 1.25mm Wire to Board Wafer, Vertical, Through Hole, 15 Positions
Tech specs 　 　

Official Product Page

    70287-1084

Molex Electronics Ltd.
Part No. 70287-1084
Description 2.54mm (.100) Pitch C-Grid? Header, Breakaway, Dual Row, Vertical, with RetentionPin, 74 Circuits, 8.13mm (.320) Mating Pin Length, Tin (Sn) Plating
File Size 303.42K  /  5 Page

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Amphenol Communications Solutions
Part No. 10114831-10115LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 15 POSITIONS, TIN PLATING
Tech specs 　 　

Official Product Page

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