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  70567-0008 Datasheet PDF File

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    70567-0125

Molex Electronics Ltd.
Part No. 70567-0125
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, VerticalShrouded, High Temperature, 50 Circuits, Tin (Sn) Plating

File Size 1,211.75K  /  7 Page

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Amphenol Cables on Demand

Part No. CS-VHDCIMX200-008
Description Amphenol CS-VHDCIMX200-008 VHDCI SCSI (SCSI-5) LVD/SE Cable - .8mm 68-pin VHDCI SCSI Male to Male 8m
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    70567-0120

Molex Electronics Ltd.
Part No. 70567-0120
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, VerticalShrouded, High Temperature, 40 Circuits, Tin (Sn) Plating

File Size 1,211.71K  /  7 Page

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Amphenol Communications Solutions

Part No. 20021121-00008T8LF
Description Minitek127®, Board to Board connector, Unshrouded vertical header, Surface Mount, Double Row, 8Positions, 1.27mm (0.5inch) pitch.
Tech specs    

Official Product Page

    A-70567-0279

Molex Electronics Ltd.
Part No. A-70567-0279
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 18 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating

File Size 1,218.38K  /  7 Page

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Amphenol Communications Solutions

Part No. 20021121-00086T4LF
Description Minitek127®, Board to Board connector, Unshrouded vertical header, Surface Mount, Double Row, 86Positions, 1.27mm (0.5inch) pitch.
Tech specs    

Official Product Page

    70567-0013 A-70567-0013 15-80-0301

Molex Electronics Ltd.
Part No. 70567-0013 A-70567-0013 15-80-0301
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 30 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 30 Circuits, Tin (Sn) Plating

File Size 1,218.41K  /  7 Page

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Amphenol Communications Solutions

Part No. 20021444-00008T1LF
Description Minitek127®, Wire to Board connector, IDC Receptacle, Double Row, 8 Positions, 1.27 mm (.050in) * 1.27 mm (.050in) Pitch.
Tech specs    

Official Product Page

    A-70567-0014 15-80-0321

Molex Electronics Ltd.
Part No. A-70567-0014 15-80-0321
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 32 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 32 Circuits, Tin (Sn) Plating

File Size 1,218.23K  /  7 Page

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Amphenol Communications Solutions

Part No. 20021221-00008T4LF
Description Minitek127®, Wire to Board connector, Shrouded vertical header, Surface Mount, Double Row, 8 Positions, 1.27mm (0.500in) Pitch.
Tech specs    

Official Product Page

    70567-0016 A-70567-0016 15-81-0361

Molex Electronics Ltd.
Part No. 70567-0016 A-70567-0016 15-81-0361
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 36 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 36 Circuits, Tin (Sn) Plating

File Size 1,218.45K  /  7 Page

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Amphenol Communications Solutions

Part No. 51701-10000804AALF
Description PwrBlade®, Power Supply Connectors, 8S 4P STB Vertical Header.
Tech specs    

Official Product Page

    A-70567-0364 15-80-1521

Molex Electronics Ltd.
Part No. A-70567-0364 15-80-1521
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 52 Circuits, 0.76渭m (30渭) Gold, (Au) Selective Pla
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 52 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating

File Size 1,218.35K  /  7 Page

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Amphenol Communications Solutions

Part No. 20021321-00086D4LF
Description Minitek127®, Board to Board connectors, PCB mounted Receptacle, Vertical, Surface Mount, Double Row, 86 Positions, 1.27mm (0.05inch) pitch
Tech specs    

Official Product Page

    70567-0143 15-80-0185

Molex Electronics Ltd.
Part No. 70567-0143 15-80-0185
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 18 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 1,218.29K  /  7 Page

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Amphenol Communications Solutions

Part No. 20021221-00008T8LF
Description Minitek127®, Wire to Board connector, Shrouded vertical header, Surface Mount, Double Row, 8 Positions, 1.27mm (0.500in) Pitch.
Tech specs    

Official Product Page

    0705670131 70567-0131

Molex Electronics Ltd.
Part No. 0705670131 70567-0131
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, VerticalShrouded, High Temperature, 62 Circuits, Tin (Sn) Plating
MOLEX Connector

File Size 1,211.95K  /  7 Page

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Amphenol Communications Solutions

Part No. 20021311-00088T1LF
Description 1.27mm (0.05in.) pitch, Receptacle Top entry, 88 contacts
Tech specs    

Official Product Page

   
Part No. 0008
Description From old datasheet system

File Size 49.19K  /  2 Page

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Amphenol Communications Solutions

Part No. 20021111-00086T4LF
Description Minitek127®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 86 Positions, 1.27mm (0.050in) pitch.
Tech specs    

Official Product Page

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