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  71764-0108 Datasheet PDF File

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    71764-0130

Molex Electronics Ltd.
Part No. 71764-0130
Description 2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 30 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating

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Amphenol Communications Solutions

Part No. 10144700-108KLF
Description Minitek MicroSpace™ 1.27mm Crimp-to-Wire Connector Platform, Wire to Board Connector, Vertical, Header, Surface Mount, 8 Position,side to side,side latch<br><br>(For product qualification latest status, please submit <a href=\\javascript:;\\ class=\\button product-enquiry\\ style=\\background: none;color: red;\\><span>Product Enquiry</span></a>)
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HUA FENG CIRCUIT





    71764-0106

Molex Electronics Ltd.
Part No. 71764-0106
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 6 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 6 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating

File Size 121.09K  /  5 Page

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Amphenol Communications Solutions

Part No. G832MB010805022HR
Description 0.80mm Board-to-Board 85Ω Connector, Pitch 0.8mm, Height 7.7 mm, 80 Positions, Dual Row, BTB Vertical Receptacle SMT, Gold Flash Black.
Tech specs    

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    71764-0224

Molex Electronics Ltd.
Part No. 71764-0224
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 24 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 121.00K  /  5 Page

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Amphenol Communications Solutions

Part No. G832MB010801222HR
Description 0.80mm Board-to-Board 85Ω Connector, Pitch 0.8mm, Height 3.7 mm, 80 Positions, Dual Row, BTB Vertical Receptacle SMT, 30u\\ Gold Black.
Tech specs    

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    71764-0222

Molex Electronics Ltd.
Part No. 71764-0222
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, DualRow, Right Angle,High Temperature, 22 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 121.00K  /  5 Page

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Amphenol Communications Solutions

Part No. G832MC010801022HR
Description 0.80mm Board-to-Board 100Ω Connector, Pitch 0.8mm, Height 3.7 mm, 80 Positions, Dual Row, BTB Vertical Receptacle SMT, Gold Flash Black.
Tech specs    

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    71764-0228

Molex Electronics Ltd.
Part No. 71764-0228
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 28 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 121.07K  /  5 Page

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Amphenol Communications Solutions

Part No. 10108777-10210TLF
Description PCI Express® GEN 3 Card Edge, Storage and Server Connector, Vertical, Through Hole, x1, 36 Position, Plastic Pegs
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    71764-0226

Molex Electronics Ltd.
Part No. 71764-0226
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 26 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 120.93K  /  5 Page

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Amphenol Communications Solutions

Part No. 10112690-F01-08ULF
Description Header, Surface Mount, Double row, 16, 2mm (0.079in), Right Angle
Tech specs    

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    71764-0220

Molex Electronics Ltd.
Part No. 71764-0220
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right Angle, High Temperature, 20 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 120.87K  /  5 Page

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Amphenol Communications Solutions

Part No. 10072354-F01-08ULF
Description Minitek®, Wire to Board Connectors, Shrouded Header - Through Mount Pin-in-Paste - Double row - 8 Positions - 2mm (0.079inch) - Right Angle
Tech specs    

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    71764-0120

Molex Electronics Ltd.
Part No. 71764-0120
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 20 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 20 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating

File Size 121.16K  /  5 Page

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Amphenol Communications Solutions

Part No. 10108777-10113HLF
Description PCI Express® GEN 3 Card Edge, Storage and Server Connector, Vertical, Through Hole, x16, 164 Positions, 1.00mm (0.039in) Pitch
Tech specs    

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    71764-0008

Molex Electronics Ltd.
Part No. 71764-0008
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 8 Circuits, Tin (Sn) Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 8 Circuits, Tin (Sn) Plating

File Size 121.06K  /  5 Page

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Amphenol Communications Solutions

Part No. 10108777-11100TLF
Description PCI Express® GEN 3 Card Edge, Storage and Server Connector, Vertical, Through Hole, x1, 36 Positions, 1.00mm (0.039in) Pitch
Tech specs    

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    71764-0004

Molex Electronics Ltd.
Part No. 71764-0004
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 4 Circuits, Tin (Sn) Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 4 Circuits, Tin (Sn) Plating

File Size 121.13K  /  5 Page

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Amphenol Communications Solutions

Part No. 51740-10802408CALF
Description PwrBlade®, Power Supply Connectors, 8P 24S 8P Vertical Receptacle.
Tech specs    

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