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  71764-0130 Datasheet PDF File

For 71764-0130 Found Datasheets File :: 150+       Page :: | 1 | <2> | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    71764-0104

Molex Electronics Ltd.
Part No. 71764-0104
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right Angle,High Temperature, 4 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right Angle,High Temperature, 4 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating

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Amphenol Communications Solutions

Part No. 10130611-101LF
Description ExaMEZZ® 56Gb/s High Speed Mezzanine Connector System, 4-Pair, 8 column, 112 position, Right Angle Receptacle, No Guide Pin.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    71764-0228

Molex Electronics Ltd.
Part No. 71764-0228
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 28 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 121.07K  /  5 Page

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Amphenol Communications Solutions

Part No. 54112-801300800LF
Description BERGSTIK STACKING
Tech specs    

Official Product Page

    71764-0226

Molex Electronics Ltd.
Part No. 71764-0226
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 26 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 120.93K  /  5 Page

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Amphenol Communications Solutions

Part No. 91601-304ALF
Description Dubox®, Board to Board connector, 2.54mm (0.100in), Receptacle, Vertical, Surface Mount, Single Row, 4 positions
Tech specs    

Official Product Page

    71764-0024

Molex Electronics Ltd.
Part No. 71764-0024
Description 2.54mm (.100) Pitch C-Grid Breakaway Header, Low Profile, Dual Row, Right Angle, High Temperature, 24 Circuits
2.54mm (.100") Pitch C-Grid Breakaway Header, Low Profile, Dual Row, Right Angle, High Temperature, 24 Circuits

File Size 120.83K  /  5 Page

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Amphenol Communications Solutions

Part No. 10072354-F01-30ULF
Description Minitek®, Wire to Board Connectors, Shrouded Header - Through Mount Pin-in-Paste - Double row - 30 Positions - 2mm (0.079inch) - Right Angle
Tech specs    

Official Product Page

    71764-0004

Molex Electronics Ltd.
Part No. 71764-0004
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 4 Circuits, Tin (Sn) Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 4 Circuits, Tin (Sn) Plating

File Size 121.13K  /  5 Page

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Amphenol Communications Solutions

Part No. 77315-101-30LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 30 Positions 2.54 mm (0.100in) Pitch, Right Angle
Tech specs    

Official Product Page

    71764-0008

Molex Electronics Ltd.
Part No. 71764-0008
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 8 Circuits, Tin (Sn) Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 8 Circuits, Tin (Sn) Plating

File Size 121.06K  /  5 Page

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Amphenol Communications Solutions

Part No. 20021521-00130C4LF
Description Minitek127®, Shrouded Board to Board Header, Surface Mount, 30 positions, 1.27mm (0.500in) pitch.
Tech specs    

Official Product Page

    71764-0222

Molex Electronics Ltd.
Part No. 71764-0222
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, DualRow, Right Angle,High Temperature, 22 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 121.00K  /  5 Page

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Amphenol Communications Solutions

Part No. 95278-101-30LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 30 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs    

Official Product Page

    71764-0220

Molex Electronics Ltd.
Part No. 71764-0220
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right Angle, High Temperature, 20 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 120.87K  /  5 Page

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Amphenol Communications Solutions

Part No. 55510-130TRLF
Description <span style=\\background-color: #FFFF00\\><b>PREFERRED P/N SERIES FOR NEW PROJECT: 10131937</b></span><br><br>Minitek® 2.00mm, Board to Board Connector, PCB Mounted Receptacle , Vertical , Surface Mount, Double row, 30 Positions, 2.00mm (0.079in) Pitch.
Tech specs    

Official Product Page

    71764-0026

Molex Electronics Ltd.
Part No. 71764-0026
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 26 Circuits, Tin (Sn) Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 26 Circuits, Tin (Sn) Plating

File Size 121.06K  /  5 Page

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Amphenol Communications Solutions

Part No. 67013-009LF
Description Berg Duflex Housing, single row, 9 Position.
Tech specs    

Official Product Page

    71764-0022

Molex Electronics Ltd.
Part No. 71764-0022
Description 2.54mm (.100) Pitch C-Grid Breakaway Header, Low Profile, Dual Row, Right Angle, High Temperature
2.54mm (.100") Pitch C-Grid Breakaway Header, Low Profile, Dual Row, Right Angle, High Temperature

File Size 120.83K  /  5 Page

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Amphenol Communications Solutions

Part No. 10130521-101LF
Description AirMax VSe®, Backplane Connectors, 4-Pair, 72 -position, 2mm pitch, 6 column, Vertical Header, small press-fit, 2 side plating, with cover.
Tech specs    

Official Product Page

For 71764-0130 Found Datasheets File :: 150+       Page :: | 1 | <2> | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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