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Molex Electronics Ltd.
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| Part No. |
71764-0120
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| Description |
2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 20 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 20 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating
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| File Size |
121.16K /
5 Page |
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it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
10136654-0222LF
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| Description |
Minitek® Pwr 3.0, Single Row, Right Angle Through Hole Header, Gold Flash plating, 2 Positions, Black Color, Non GW Compatible LCP, Tray packing.
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
71764-0118
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| Description |
2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right Angle, High Temperature, 18 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right Angle, High Temperature, 18 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating
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| File Size |
120.86K /
5 Page |
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it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
10127820-0222LLF
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| Description |
Minitek® Pwr 4.2, Dual Row, Vertical Through Hole Header, 80u\\ Min Tin plating, Natural Color, 2 Positions, LCP, GW Compatible, Tray Packing.
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
71764-0116
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| Description |
2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 16 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 16 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating
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| File Size |
121.10K /
5 Page |
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it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
G832MB131202222HR
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| Description |
0.80mm Board-to-Board 85Ω Connector, Pitch 0.8mm, Height 4.7 mm, 120 Positions, Dual Row, BTB Vertical Plug SMT, 30u\\ Gold White.
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
71764-0114
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| Description |
2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right Angle,High Temperature, 14 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right Angle,High Temperature, 14 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating
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| File Size |
121.23K /
5 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
G832MC110402222HR
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| Description |
0.80mm Board-to-Board 100Ω Connector, Pitch 0.8mm, Height 4.7 mm, 40 Positions, Dual Row, BTB Vertical Plug SMT, 30u\\ Gold Black.
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
71764-0108
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| Description |
2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right Angle,High Temperature, 8 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right Angle,High Temperature, 8 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating
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| File Size |
121.01K /
5 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
68022-272
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| Description |
BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 72 Positions, 2.54 mm (0.100in)Pitch.
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
71764-0106
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| Description |
2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 6 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 6 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating
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| File Size |
121.09K /
5 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
68022-266HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 66 Positions, 2.54 mm (0.100in)Pitch.
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
71764-0104
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| Description |
2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right Angle,High Temperature, 4 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right Angle,High Temperature, 4 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating
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| File Size |
121.22K /
5 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
68022-258HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 58 Positions, 2.54 mm (0.100in)Pitch.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
88902-226LF
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| Description |
5 Row Signal Header, Straight, Press-Fit, Wide body, 30 Position
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
71764-0004
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| Description |
2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 4 Circuits, Tin (Sn) Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 4 Circuits, Tin (Sn) Plating
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| File Size |
121.13K /
5 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
68002-225HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 25 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10127820-2222LLF
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| Description |
Minitek® Pwr 4.2, Dual Row, Vertical Through Hole Header, 80u\\ Min Tin plating, Natural Color, 22 Positions, LCP, GW Compatible, Tray Packing.
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Official Product Page
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