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  75844-182-50 Datasheet PDF File

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    14-60-0182

Molex Electronics Ltd.
Part No. 14-60-0182
Description 2.54mm (.100) Pitch SL?/a> Insulation Displacement Connector Assembly, Female,Single Row, Version G, Positive Lock, Wire Size 24, 3.81μm (150μ) Tin/Lead (SnPb),18 Circuits

File Size 161.89K  /  3 Page

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Amphenol Communications Solutions

Part No. 75844-107-72LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 72 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    14-45-1824

Molex Electronics Ltd.
Part No. 14-45-1824
Description 2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 28, 3.81μm (150μ) Tin (Sn), 24 Circuits

File Size 141.70K  /  2 Page

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Amphenol Communications Solutions

Part No. 75844-342-10LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 10 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    TCP-2-182-75X

Mini-Circuits
Part No. TCP-2-182-75X
Description Power Splitter/Combiner

File Size 359.40K  /  3 Page

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Amphenol Communications Solutions

Part No. 75844-122-72LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 72 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    ARIES ELECTRONICS INC
Part No. 32-C182-21
Description DIP32, IC SOCKET

File Size 202.59K  /  1 Page

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Amphenol Communications Solutions

Part No. 75844-340-10LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 10 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    14-45-1825

Molex Electronics Ltd.
Part No. 14-45-1825
Description 2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 28, 3.81μm (150μ) Tin (Sn), 25 Circuits

File Size 141.69K  /  2 Page

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Amphenol Communications Solutions

Part No. 75844-302-06LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 6 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    14-45-1821

Molex Electronics Ltd.
Part No. 14-45-1821
Description 2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly

File Size 141.69K  /  2 Page

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Amphenol Communications Solutions

Part No. 75844-112-56LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 56 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    Zcomax
Part No. XG-182M
Description IEEE 802.11b/g Wireless SDIO/SPI Module

File Size 423.48K  /  11 Page

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Amphenol Communications Solutions

Part No. 75844-194-20LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 20 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    14-45-1820

Molex Electronics Ltd.
Part No. 14-45-1820
Description 2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 28, 3.81μm (150μ) Tin (Sn), 20 Circuits

File Size 150.54K  /  3 Page

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Amphenol Communications Solutions

Part No. 75844-127-18LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 18 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    BOURNS[Bourns Electronic Solutions]
Part No. 8182
Description Metal shaft and bushing

File Size 244.04K  /  5 Page

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Amphenol Communications Solutions

Part No. 75844-118-10LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 10 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    Intersil
Part No. HS-3182
Description Bus Interface Line Driver, ARINC 429 Standard

File Size 71.16K  /  5 Page

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Amphenol Communications Solutions

Part No. 75844-156-14LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 14 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

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