80610 pdf Datasheet P2 Part Num --- IC-ON-LINE


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80610 Datasheet PDF File

For 80610 Found Datasheets File :: 28+ Page :: | 1 | <2> | 3 |

					Molex Electronics Ltd.
Part No.	0923180610
Description	Picoflex PF-50 IDT-Board In Z-Style, 6 Circuits, 0.10m (3.94") Length
File Size	98.69K / 2 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54242-806101150LF
Description	BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 10 Positions, 2.54mm (0.100in) Pitch.
Tech specs				Official Product Page

HUA FENG CIRCUIT

					Molex Electronics Ltd.
Part No.	78061-0012 0780610012
Description	1.00mm (.039") Pitch Fully Buffered DIMM Socket, Vertical, Through Hole, 0.76um (30u") Gold(Au) Selective Plating 1.00mm (.039) Pitch Fully Buffered DIMM Socket, Vertical, Through Hole, 0.76um (30u) Gold(Au) Selective Plating
File Size	361.93K / 7 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54122-108061000LF
Description	BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 6 position, 2.54mm (0.100in) pitch
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	78061-0011 0780610011
Description	1.00mm (.039") Pitch Fully Buffered DIMM Socket, Vertical, Through Hole, 0.76渭m (30渭") Gold(Au) Selective Plating, 240 Circuits 1.00mm (.039) Pitch Fully Buffered DIMM Socket, Vertical, Through Hole, 0.76μm (30μ) Gold(Au) Selective Plating, 240 Circuits
File Size	361.88K / 7 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	75160-806-10LF
Description	BergStik®, Board to Board connector, Unshrouded vertical header, through hole, single Row,10 position, 2.54mm pitch
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	78061-0001 0780610001
Description	1.00mm (.039) Pitch Fully Buffered DIMM Socket, Vertical, Through Hole, 0.38渭m (15渭) Gold(Au) Selective Plating, 240 Circuits, with Beveled Metal Pins 1.00mm (.039) Pitch Fully Buffered DIMM Socket, Vertical, Through Hole, 0.38μm (15μ) Gold(Au) Selective Plating, 240 Circuits, with Beveled Metal Pins
File Size	361.88K / 7 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54242-806100950LF
Description	BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 10 Positions, 2.54mm (0.100in) Pitch.
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	0530480610 53048-0610
Description	1.25mm (.049) Pitch PicoBlade?/a> Header, Right Angle, 6 Circuits MOLEX Connector
File Size	86.04K / 3 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	68020-408-061033LF
Description	BergStik®, Board to Board connector, Unshrouded Right angled Header, Through Hole, Double Row, 8 Positions, 2.54mm (0.100in) Pitch.
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	0524180610 52418-0610
Description	2.00mm (.079") Pitch Board-to-Board Receptacle, Right Angle, Single Row, FrictionLock, 6 Circuits 2.00mm (.079) Pitch Board-to-Board Receptacle, Right Angle, Single Row, FrictionLock, 6 Circuits
File Size	102.88K / 3 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54122-806100850LF
Description	BergStik<sup>®<sup>, Board to Board connector, 2.54mm (0.100in), Unshrouded vertical stacking Header, Through Hole, Double Row, 10 Positions
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	0352780610 352-78-0617
Description	6.35mm (.250) Tab Width, Powermate Relay Housing, Female, Natural (Off White), 6Circuits 6.35mm (.250") Tab Width, Powermate Relay Housing, Female, Natural (Off White), 6Circuits
File Size	202.04K / 3 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	10142708-06100LF
Description	Minitek®Pwr 5.7, Vertical Through Hole Header, Dual Row, Black Color, 6 Positions, 15u\\ Gold (100u\\ Tin on Tails) plating, GW Compatible LCP, With Pegs, Tray.
Tech specs				Official Product Page

					Sanyo Semicon Device
Part No.	LE25FW80610
Description	8M-bit (1M×8) Serial Flash Memory
File Size	175.62K / 22 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	10142708-061001LF
Description	Minitek®Pwr 5.7, Vertical Through Hole Header, Dual Row, Black Color, 6 Positions, 15u\\ Gold (100u\\ Tin on Tails) plating, GW Compatible LCP, Without Pegs, Tray.
Tech specs				Official Product Page

					Fair-Rite Products Corp.
Part No.	2518061017Y0
Description	MULTI-LAYER CHIP BEAD
File Size	276.12K / 3 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54121-806100850LF
Description	BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 10 Positions, 2.54mm (0.100in) Pitch.
Tech specs				Official Product Page

					Pan Jit International Inc.
Part No.	PJUSB2080610 PJUSB208
Description	Low Capacitance Diode Array
File Size	447.69K / 4 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54111-806101270LF
Description	BERGSTIK HDR DB SR
Tech specs				Official Product Page

For 80610 Found Datasheets File :: 28+ Page :: | 1 | <2> | 3 |

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