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Renesas Electronics Corporation |
| Part No. |
UPD70F3917GF(S)-GAT-AX
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| Description |
32-bit Microcontrollers
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| Tech specs |
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Official Product Page
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Renesas Electronics Corporation |
| Part No. |
UPD70F3917GF(R)-GAT-AX
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| Description |
32-bit Microcontrollers
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
51939-178LF
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| Description |
PwrBlade®, Power Connectors, 9P 24S Right Angle Header, Solder To Board
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
93939-172HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 72 Positions, 2.54 mm Pitch, Right Angle, 4.06 mm (0.16in) Mating, 3.05 mm (0.12in) Tail.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10077239-172LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, Press Fit, Double Row, 72 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318 in.) Mating, 4.82 mm (0.19 in.) Tail
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
86093488391755E3LF
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| Description |
DIN Headers & receptacles, Backplane Connectors, Receptacle, Vertical, Press Fit, Style C/2, 48 ways, Class II.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87715-9035
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| Description |
1.00mm (.039") Pitch, PCI Express* Connector, 36 Circuits, Nylon 4/6 Glass-filled,Green (348C) Housing, Phosphor Bronze, 0.38渭m (15渭") Gold (Au) Plating, with P
1.00mm (.039) Pitch, PCI Express* Connector, 36 Circuits, Nylon 4/6 Glass-filled,Green (348C) Housing, Phosphor Bronze, 0.38μm (15μ) Gold (Au) Plating, with Plastic
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| File Size |
627.08K /
10 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
10139177-002LF
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| Description |
HPCE STRADDLE MOUNT Receptacle 2HP28S Omitted 10S
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87715-9009
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| Description |
1.00mm (.039) Pitch, PCI Express* Connector, 36 Circuits, Nylon 4/6 Glass-filled, Black Housing, Phosphor Bronze, 0.76渭m (30渭) Gold (Au) Plating
1.00mm (.039) Pitch, PCI Express* Connector, 36 Circuits, Nylon 4/6 Glass-filled, Black Housing, Phosphor Bronze, 0.76μm (30μ) Gold (Au) Plating
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| File Size |
618.39K /
10 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
93939-170HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 70 Positions, 2.54 mm Pitch, Right Angle, 4.06 mm (0.16in) Mating, 3.05 mm (0.12in) Tail.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87715-9008
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| Description |
1.00mm (.039") Pitch, PCI Express* Connector, 36 Circuits, Nylon 4/6 Glass-filled,Black Housing, Phosphor Bronze, 0.38渭m (15渭") Gold (Au) Plating, with Plastic
1.00mm (.039) Pitch, PCI Express* Connector, 36 Circuits, Nylon 4/6 Glass-filled,Black Housing, Phosphor Bronze, 0.38μm (15μ) Gold (Au) Plating, with Plastic Pegs
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| File Size |
327.13K /
6 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
68739-170HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 70 Positions, 2.54 mm (0.100in)Pitch.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87715-9005
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| Description |
1.00mm (.039") Pitch, PCI Express* Connector, 36 Circuits, Nylon 4/6 Glass-filled, Black Housing, Phosphor Bronze, 0.38渭m (15渭") Gold (Au) Plating, with Plastic
1.00mm (.039) Pitch, PCI Express* Connector, 36 Circuits, Nylon 4/6 Glass-filled, Black Housing, Phosphor Bronze, 0.38μm (15μ) Gold (Au) Plating, with Plastic Pegs
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| File Size |
618.52K /
10 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
51939-173LF
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| Description |
PwrBlade®, Power Connectors, 4ACP 3P 20S Right Angle Header, Solder To Board
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| Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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