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  87758-0217 Datasheet PDF File

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    87758-2050

Molex Electronics Ltd.
Part No. 87758-2050
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 20 Circuits
File Size 135.92K  /  4 Page

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Texas Instruments
Part No. 5962-8775801RA
Description Octal Bus Transceivers With 3-State Outputs 20-CDIP -55 to 125
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    87758-2017

Molex Electronics Ltd.
Part No. 87758-2017
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 20 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
File Size 170.76K  /  4 Page

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Texas Instruments
Part No. 5962-87758012A
Description Octal Bus Transceivers With 3-State Outputs 20-LCCC -55 to 125
Tech specs 　 　

Official Product Page

    87758-1817

Molex Electronics Ltd.
Part No. 87758-1817
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 18 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
File Size 170.70K  /  4 Page

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Texas Instruments
Part No. 5962-8775801SA
Description Octal Bus Transceivers With 3-State Outputs 20-CFP -55 to 125
Tech specs 　 　

Official Product Page

    87758-1816

Molex Electronics Ltd.
Part No. 87758-1816
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 18 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
File Size 170.71K  /  4 Page

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Texas Instruments
Part No. 5962-8775801VSA
Description Octal Bus Transceivers With 3-State Outputs 20-CFP -55 to 125
Tech specs 　 　

Official Product Page

    87758-1650

Molex Electronics Ltd.
Part No. 87758-1650
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 16 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray Packaging, Lead-free
File Size 135.76K  /  4 Page

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Texas Instruments
Part No. TPS7A02175PYCHR
Description 200mA, nanopower-IQ (25 nA), low-dropout (LDO) voltage regulator with enable 4-DSBGA -40 to 125
Tech specs 　 　

Official Product Page

    87758-1617

Molex Electronics Ltd.
Part No. 87758-1617
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 16 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
File Size 170.76K  /  4 Page

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Amphenol Communications Solutions
Part No. 95293-402-17LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Surface mount, Single Row,17 Positions, 2.54 mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    87758-1417

Molex Electronics Ltd.
Part No. 87758-1417
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 14 Circuits, 0.76μm(30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
File Size 170.75K  /  4 Page

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Amphenol Communications Solutions
Part No. 68602-170HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 70 Positions, 2.54 mm (0.100in)Pitch.
Tech specs 　 　

Official Product Page

    87758-1416

Molex Electronics Ltd.
Part No. 87758-1416
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 14 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
File Size 170.71K  /  4 Page

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Amphenol Communications Solutions
Part No. 10131930-217ULF
Description Minitek®, Board to Board, Receptacle, Through Mount, Single row, 17 Positions, 2mm (0.079inch), horizontal.
Tech specs 　 　

Official Product Page

    87758-1850

Molex Electronics Ltd.
Part No. 87758-1850
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 18 Circuits
2.00mm (.079") Pitch Milli-Grid Header, Through Hole, Vertical, 18 Circuits
File Size 135.97K  /  4 Page

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Amphenol Communications Solutions
Part No. 68021-704HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 04 Positions, 2.54 mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    87758-2417

Molex Electronics Ltd.
Part No. 87758-2417
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 24 Circuits, 0.76μm(30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
File Size 170.76K  /  4 Page

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Amphenol Communications Solutions
Part No. 54121-109021700LF
Description BergStik®, Board to Board connector, Unshrouded Stacking vertical header, Through Hole, Double Row, 2 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

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