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  A-70567-0283 Datasheet PDF File

For A-70567-0283 Found Datasheets File :: 129+       Page :: | 1 | <2> | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 |   

    70567-0018

Molex Electronics Ltd.
Part No. 70567-0018
Description 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 40 Circuits, Tin (Sn) Plating

File Size 1,218.45K  /  7 Page

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Texas Instruments

Part No. TLIN10283SDRQ1
Description Automotive local interconnect network (LIN) Transceiver with integrated voltage regulator
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    70567-0120

Molex Electronics Ltd.
Part No. 70567-0120
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, VerticalShrouded, High Temperature, 40 Circuits, Tin (Sn) Plating

File Size 1,211.71K  /  7 Page

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Texas Instruments

Part No. TLIN10283DDARQ1
Description Automotive local interconnect network (LIN) transceiver with integrated voltage regulator 8-SO PowerPAD -40 to 125
Tech specs    

Official Product Page

    70567-0125

Molex Electronics Ltd.
Part No. 70567-0125
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, VerticalShrouded, High Temperature, 50 Circuits, Tin (Sn) Plating

File Size 1,211.75K  /  7 Page

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Texas Instruments

Part No. TLIN10283DRBRQ1
Description Automotive local interconnect network (LIN) transceiver with integrated voltage regulator 8-SON -40 to 125
Tech specs    

Official Product Page

    A-70567-0019

Molex Electronics Ltd.
Part No. A-70567-0019
Description 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 42 Circuits, Tin (Sn) Plating

File Size 1,218.42K  /  7 Page

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Texas Instruments

Part No. TLIN10283DRQ1
Description Automotive local interconnect network (LIN) transceiver with integrated voltage regulator 8-SOIC -40 to 125
Tech specs    

Official Product Page

    A-70567-0020

Molex Electronics Ltd.
Part No. A-70567-0020
Description 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 44 Circuits, Tin (Sn) Plating

File Size 1,218.41K  /  7 Page

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    A-70567-0021

Molex Electronics Ltd.
Part No. A-70567-0021
Description 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 46 Circuits, Tin (Sn) Plating

File Size 1,218.42K  /  7 Page

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    A-70567-0022

Molex Electronics Ltd.
Part No. A-70567-0022
Description 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 48 Circuits, Tin (Sn) Plating

File Size 1,218.42K  /  7 Page

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    22-28-3038 42225-0283 A-42225-0283

Molex Electronics Ltd.
Part No. 22-28-3038 42225-0283 A-42225-0283
Description 2.54mm (.100) Pitch KK? Header, Breakaway, Vertical, with Polarizing Wall, 3 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, with Backwalls Removed

File Size 190.51K  /  8 Page

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    70567-0013 A-70567-0013 15-80-0301

Molex Electronics Ltd.
Part No. 70567-0013 A-70567-0013 15-80-0301
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 30 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 30 Circuits, Tin (Sn) Plating

File Size 1,218.41K  /  7 Page

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    70567-0016 A-70567-0016 15-81-0361

Molex Electronics Ltd.
Part No. 70567-0016 A-70567-0016 15-81-0361
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 36 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 36 Circuits, Tin (Sn) Plating

File Size 1,218.45K  /  7 Page

View it Online

Download Datasheet

For A-70567-0283 Found Datasheets File :: 129+       Page :: | 1 | <2> | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 |   

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