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NXP Semiconductors N.V.
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| Part No. |
BGA2709
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| Description |
MMIC wideband amplifier BGA2709<SOT363 (TSSOP6)|<<http://www.nxp.com/packages/SOT363.html<1<week 23, 2003,;
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| File Size |
103.18K /
12 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
77311-127-09LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 09 Positions, 2.54 mm Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
MDB227093205BP
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| Description |
Rugged D-Sub Accessory, Input Output Connectors, Dust Cover, for 9 Pin Harsh D-sub
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
77311-827-09LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 09 Positions, 2.54 mm Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
77311-427-09LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 09 Positions, 2.54 mm Pitch.
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| Tech specs |
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Official Product Page
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Price and Availability
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