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  chipscale Datasheet PDF File

For chipscale Found Datasheets File :: 149    Search Time::1.063ms    
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    Maxim Integrated Products, Inc.
Part No. MAX4131 MAX4131ESA
OCR Text ...ultra-small 6-bump, 1mm x 1.5mm chipscale package (UCSPTM). o 6-Bump UCSP (MAX4131) o +2.7V to +6.5V Single-Supply Operation o Rail-to-Rail Input Common-Mode Voltage Range o Rail-to-Rail Output Voltage Swing o 10MHz Gain-Bandwidth Product o...
Description Single/Dual/Quad, Wide-Bandwidth, Low-Power, Single-Supply Rail-to-Rail I/O Op Amps OP-AMP, 750 uV OFFSET-MAX, 10 MHz BAND WIDTH, PDSO8
"Single, Wide-Bandwidth, Low-Power, Single-Supply, Rail-to-Rail, I/O Op Amp in UCSP"

File Size 405.19K  /  18 Page

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    ISL84684II ISL84684IIZ-T

INTERSIL[Intersil Corporation]
Part No. ISL84684II ISL84684IIZ-T
OCR Text ...ply, Dual SPDT Analog Switch in chipscale Package The Intersil ISL84684II device is a low ON-resistance, low voltage, bidirectional, dual single-pole/double-throw (SPDT) analog switch designed to operate from a single +1.8V to +4.5V supply...
Description Ultra Low ON-Resistance, Low Voltage, Single Supply, Dual SPDT Analog Switch in chipscale Package

File Size 326.61K  /  11 Page

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    MAXIM - Dallas Semiconductor
Part No. MAX2246EVKIT
OCR Text ... (0402) MAX2244EBL 9-bump ultra chipscale package (UCSPTM) MAX2244 EV kit PC board MAX2244 data sheet C2 1 J1, J2, J5 J3, J4 JU1 JU1 R1, R3 R2 U1 None None 3 2 1 1 2 1 1 1 1 C3, C9, C11 3 C4 1 C5, C6 2 C7 ...
Description Evaluation Kits for the MAX2244/MAX2245/MAX2246

File Size 185.14K  /  7 Page

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    Maxim
Part No. DS3171 DS3172
OCR Text ...High-Density Thermally Enhanced chipscale BGA Packaging (TE-CSBGA) with 1.27mm Pin Pitch Industrial Temperature Operation: -40C to +85C IEEE1149.1 JTAG Test Port DETAILED DESCRIPTION The DS3171 (single), DS3172 (dual), DS3173 (triple), ...
Description Single/Dual/Triple/Quad DS3/E3 Single-Chip Transceivers

File Size 1,902.35K  /  232 Page

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    Maxim
Part No. MAX4256 MAX4255
OCR Text ...X4252 is available in an 8-bump chipscale package (UCSPTM) and the MAX4253 is available in a 10-bump UCSP. Features o Available in Space-Saving UCSP, SOT23, and MAX Packages o Low Distortion: 0.0002% THD (1k load) o 400A Quiescent Suppl...
Description "Low-Noise/Distortion, Low-Power, Rail-to-Rail Op Amp with Shutdown (Av > +10V/V)"
"Low-Noise/Distortion, Low-Power, Rail-to-Rail Op Amp (Av > +10V/V) in SOT23"

File Size 1,111.47K  /  19 Page

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    SI8900EDB

VISAY[Vishay Siliconix]
Part No. SI8900EDB
OCR Text ...otected: 4000 V New MICRO FOOTt chipscale Packaging Reduces Footprint Area Profile (0.62 mm) and On-Resistance Per Footprint Area APPLICATIONS D Battery Protection Circuit - 1-2 Cell Li+/LiP Battery Pack for Portable Devices S1 MICR...
Description Bidirectional N-Channel 20-V (D-S) MOSFET
Bi-Directional N-Channel 20-V (D-S) MOSFET

File Size 51.77K  /  5 Page

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    Maxim
Part No. DS3182 DS3183 DS3181 DS3181-DS3184
OCR Text ...gh-Density, Thermally Enhanced, chipscale BGA Packaging (TE-CSBGA) with 1.27mm Pin Pitch Industrial Temperature Operation: -40C to +85C IEEE1149.1 JTAG Test Port DETAILED DESCRIPTION The DS3181 (single), DS3182 (dual...
Description Single/Dual/Triple/Quad ATM/Packet PHYs with Built-In LIU
From old datasheet system

File Size 3,922.22K  /  386 Page

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    Maxim Integrated Products Inc
Part No. MAX2240EPL
OCR Text ...Single-Supply Operation o Ultra-chipscale Package (1.56mm x 1.56mm) General Description The MAX2240 single-supply, low-voltage power amplifier (PA) IC is designed specifically for applications in the 2.4GHz to 2.5GHz frequency band. The...
Description Amplifier, Other - Datasheet Reference
From old datasheet system

File Size 186.37K  /  10 Page

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For chipscale Found Datasheets File :: 149    Search Time::1.063ms    
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