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Rochester Electronics LLC |
| Part No. |
MD27256-20/B
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| Description |
27256 - 256K (32K x 8) UV Erasable PROM
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
77311-427-25LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 25 Positions, 2.54 mm Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
77311-127-25LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 25 Positions, 2.54 mm Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
77311-827-25LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 25 Positions, 2.54 mm Pitch.
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| Tech specs |
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Official Product Page
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| Part No. |
EKIN2-947
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| Description |
QFN Packaged, ±15kV ESD Protected, 2.7V to 5.5V, 10nA, 250kbps, RS-232 Transmitters/Receivers; Temperature Range: -40°C to 85°C; Package: 32-QFN
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| File Size |
36.48K /
1 Page |
 View
it Online |
Download Datasheet
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M/A-COM Technology Solutions, Inc.
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| Part No. |
EKIN2-950
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| Description |
QFN Packaged, ±15kV ESD Protected, 2.7V to 5.5V, 10nA, 250kbps, RS-232 Transmitters/Receivers; Temperature Range: -40°C to 85°C; Package: 32-QFN
QFN Packaged, ±15kV ESD Protected, 2.7V to 5.5V, 10nA, 250kbps, RS-232 Transmitters/Receivers; Temperature Range: -40°C to 85°C; Package: 32-QFN 模拟IC
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| File Size |
52.87K /
1 Page |
View
it Online |
Download Datasheet |
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Bom2Buy.com
Price and Availability
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