FC30 pdf Datasheet P2 Part Num --- IC-ON-LINE


	Part Number	Hot Search : DCB010 93C66 CD4081 S3C7032 72200 MAX4350 XP4601 D4701A
	Product Description
	Full Text Search

FC30 Datasheet PDF File

For FC30 Found Datasheets File :: 42+ Page :: | 1 | <2> | 3 | 4 | 5 |

					COMCHIP[Comchip Technology]
Part No.	CEFC305-G CEFC301-G CEFC302-G CEFC303-G CEFC304-G
Description	SMD Efficient Fast Recovery Rectifier
File Size	66.96K / 2 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	L717SDA15P1ACH4FC309
Description	Dsub, Stamped Signal 3A, Right Angle PCB Through Hole, FP=10.40mm (0.409in), Row Pitch 2.54mm, 15 Pin, 0.76m (30in) Gold, Bright Tin Shell+Grounding Dimples, 4-40 Front Screwlock, Ground Tab with Boardlock
Tech specs				Official Product Page

HUA FENG CIRCUIT


Part No.	GP1FC300TP
Description	FIBER OPTIC TRANSMITTERS
File Size	34.75K / 2 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	L77SDC37SA4CH3FC309
Description	Dsub, Stamped Signal 3A, Right Angle PCB Through Hole, FP=8.08mm (0.318in), Row Pitch 2.84mm, 37 Socket, 0.76m (30in) Gold, Bright Tin Shell, M3 Front Screwlock, Ground Tab with Boardlock
Tech specs				Official Product Page

					IXYS Corporation
Part No.	IXFC30N60P
Description	PolarHV HiPerFET Power MOSFET
File Size	131.22K / 4 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	L77SDE09SABCH4FC309
Description	Dsub, Stamped Signal 3A, Right Angle PCB Through Hole, FP=14.84mm (0.584in), Row Pitch 2.84mm, 09 Socket, 0.76m (30in) Gold, Bright Tin Shell, 4-40 Front Screwlock, Ground Tab with Boardlock
Tech specs				Official Product Page


Part No.	K7J160882B-FC300
Description	2M X 8 DDR SRAM, 0.45 ns, PBGA165
File Size	181.41K / 18 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	L77HDCH62SVFC309
Description	Dsub, Stamped Signal 3A, Straight Soldercup, 62 Socket, Bright Tin Shell, 0.76m (30 in) Gold, 4-40 Removable Front Screwlock, 4-40 Rear Nut
Tech specs				Official Product Page

					Samsung Semiconductor Co., Ltd. SAMSUNG SEMICONDUCTOR CO. LTD. SAMSUNG[Samsung semiconductor] Samsung Electronic
Part No.	K7I161882B-FC16 K7I161882B-FC20 K7I161882B-FC25 K7I161882B-FC30 K7I163682B-FC30 K7I163682B K7I163682B-FC16 K7I163682B-FC20 K7I163682B-FC25
Description	512Kx36-bit, 1Mx18-bit DDRII CIO b2 SRAM 512Kx36位，1Mx18位首席信息官b2DDRII的SRAM GT 35C 35#16 PIN PLUG RTANG
File Size	375.70K / 17 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	L717SDB25P1ACH3FC309
Description	Dsub, Stamped Signal 3A, Right Angle PCB Through Hole, FP=10.40mm (0.409in), Row Pitch 2.54mm, 25 Pin, 0.76m (30in) Gold, Bright Tin Shell+Grounding Dimples, M3 Front Screwlock, Ground Tab with Boardlock
Tech specs				Official Product Page

					SAMSUNG[Samsung semiconductor]
Part No.	K7I643682M-FC30 K7I641882M K7I641882M-EI16 K7I641882M-EI20 K7I641882M-EI25 K7I641882M-EI30 K7I641882M-FC16 K7I641882M-FC20 K7I641882M-FC25 K7I641882M-FC30 K7I643682M K7I643682M-EI16 K7I643682M-EI20 K7I643682M-EI25 K7I643682M-EI30 K7I643682M-FC16 K7I643682M-FC20 K7I643682M-FC25
Description	72Mb M-die DDRII SRAM Specification 165 FBGA with Pb & Pb-Free (RoHS compliant)
File Size	301.37K / 17 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	L717SDB25PA4CH4FC309
Description	Dsub, Stamped Signal 3A, Right Angle PCB Through Hole, FP=8.08mm (0.318in), Row Pitch 2.84mm, 25 Pin, 0.76m (30in) Gold, Bright Tin Shell+Grounding Dimples, 4-40 Front Screwlock, Ground Tab with Boardlock
Tech specs				Official Product Page

					SAMSUNG SEMICONDUCTOR CO. LTD.
Part No.	K7R320982C K7R323682C-FC20 K7R323682C-FC25 K7R323682C-FCI20 K7R323682C-FCI30 K7R323682C-FC30 K7R323682C-FCI25 K7R323682C-FEC30 K7R323682C-FEC20 K7R323682C-FEC25 K7R323682C-FC250
Description	1Mx36 & 2Mx18 & 4Mx9 QDR II b2 SRAM
File Size	462.59K / 20 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	L77SDA15S1ACH3FC309
Description	Dsub, Stamped Signal 3A, Right Angle PCB Through Hole, FP=10.40mm (0.409in), Row Pitch 2.54mm, 15 Socket, 0.76m (30in) Gold, Bright Tin Shell, M3 Front Screwlock, Ground Tab with Boardlock
Tech specs				Official Product Page

					SAMSUNG[Samsung semiconductor]
Part No.	K7J643682M-FECI30 K7J641882M K7J641882M-FC16 K7J641882M-FC20 K7J641882M-FC25 K7J641882M-FC30 K7J641882M-FECI16 K7J641882M-FECI20 K7J641882M-FECI25 K7J641882M-FECI30 K7J643682M K7J643682M-FC16 K7J643682M-FC20 K7J643682M-FC25 K7J643682M-FC30 K7J643682M-FECI16 K7J643682M-FECI20 K7J643682M-FECI25
Description	72Mb M-die DDRII SRAM Specification
File Size	312.35K / 17 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	L77SDC37S1ACH4FC309
Description	Dsub, Stamped Signal 3A, Right Angle PCB Through Hole, FP=10.40mm (0.409in), Row Pitch 2.54mm, 37 Socket, 0.76m (30in) Gold, Bright Tin Shell, 4-40 Front Screwlock, Ground Tab with Boardlock
Tech specs				Official Product Page

					SAMSUNG SEMICONDUCTOR CO. LTD. Samsung Semiconductor Co., Ltd.
Part No.	K7J641882M K7J643682M K7J641882M-FC16 K7J641882M-FC20 K7J641882M-FC25 K7J641882M-FC30 K7J643682M-FC16 K7J643682M-FC20 K7J643682M-FC25 K7J641882M-FECI16 K7J641882M-FECI25 K7J641882M-FECI20 K7J641882M-FECI30 K7J643682M-FECI16 K7J643682M-FECI20 K7J643682M-FECI25 K7J643682M-FECI30 K7J643682M-FC30
Description	72Mb M-die DDRII SRAM Specification 72Mb的M -模条DDRII规格的SRAM
File Size	318.96K / 17 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	L77HDA26SVFC309
Description	Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 26 Socket, 0.76m (30 in) Gold, Fixed 4-40 Front Screwlock, Without Bracket, Without Boardlock
Tech specs				Official Product Page

					Samsung Semiconductor Co., Ltd. SAMSUNG SEMICONDUCTOR CO. LTD. SAMSUNG[Samsung semiconductor] Samsung Electronic
Part No.	K7R161884B K7R161884B-FC16 K7R161884B-FC20 K7R161884B-FC25 K7R161884B-FC30 K7R163684B K7R163684B-FC16 K7R163684B-FC20 K7R163684B-FC25 K7R163684B-FC30 K7R320982M
Description	512Kx36 & 1Mx18 QDR II b4 SRAM 512Kx36 512Kx36 & 1Mx18 QDR II b4 SRAM 1Mx36 & 2Mx18 & 4Mx9 QDRTM II b2 SRAM
File Size	415.94K / 18 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	L77HDB44SD1CH3FC309
Description	Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (0.35u\\), 44 Socket, 0.76m (30 in) Gold, M3 Front Screwlock, Ground Tab, With Boardlock
Tech specs				Official Product Page

For FC30 Found Datasheets File :: 42+ Page :: | 1 | <2> | 3 | 4 | 5 |

▲Up To Search▲

Bom2Buy.com

Price and Availability

Price & Availability of FC30

All Rights Reserved © IC-ON-LINE 2003 - 2022

[Add Bookmark] [Contact Us] [Link exchange] [Privacy policy]

Mirror Sites : [www.datasheet.hk] [www.maxim4u.com] [www.ic-on-line.cn] [www.ic-on-line.com] [www.ic-on-line.net] [www.alldatasheet.com.cn] [www.gdcy.com] [www.gdcy.net]

. . . . .

We use cookies to deliver the best possible web experience and assist with our advertising efforts. By continuing to use this site, you consent to the use of cookies. For more information on cookies, please take a look at our Privacy Policy.

X

0.035037994384766