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  HSMS-8101 Datasheet PDF File

For HSMS-8101 Found Datasheets File :: 150+       Page :: | 1 | <2> | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

   
Part No. HSMS--270B
Description High Performance Schottky Diode for Transient Suppression(用于瞬变抑制的高性能肖特基二极管)

File Size 64.07K  /  8 Page

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Part No. 75168-101-10LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled header, Through Hole, Single Row, 10 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





   
Part No. HSMS-270B
Description High Performance Schottky Diode for Digital Applications (79K in pdf)

File Size 78.90K  /  7 Page

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Part No. 10114828-10102LF
Description 1.25mm Wire to Board Wafer,Vertical, Surface Mount, 2 Positions
Tech specs    

Official Product Page

    American Microsemiconductor Inc.
Part No. HSMS-0001
Description HSMS-0001

File Size 363.09K  /  1 Page

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Part No. 95278-101B24LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 24 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs    

Official Product Page

   
Part No. HSMS-281K-BLK
Description SILICON, MIXER DIODE

File Size 125.62K  /  10 Page

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Part No. 95278-101B22LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 22 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs    

Official Product Page

    L-com, Inc.
Part No. HSMS-270C-BLK
Description High Performance Schottky Diode for Transient Suppression 高性能肖特基二极管瞬态抑

File Size 103.41K  /  8 Page

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Part No. 10131318-1012100LF
Description Minitek® Pwr 4.2 HCC, Dual Row, Right Angle Through Hole Header, Gold Flash plating, Black Color, 10 Positions, Non GW Compatible Nylon66, Tray Packing.
Tech specs    

Official Product Page

   
Part No. HSMS-2702-BLK
Description UNIDIRECTIONAL, 2 ELEMENT, SILICON, TVS DIODE

File Size 223.04K  /  8 Page

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Part No. 10131318-10111G0LF
Description Minitek® Pwr 4.2 HCC, Dual Row, Right Angle Through Hole Header, Gold Flash plating, Natural Color, 10 Positions, GW Compatible Nylon66, Tray Packing.
Tech specs    

Official Product Page

    AGILENT TECHNOLOGIES INC
Part No. HSMS-2702-BLK
Description UNIDIRECTIONAL, 2 ELEMENT, SILICON, TVS DIODE

File Size 107.04K  /  8 Page

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Part No. 95278-101-36LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 36 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs    

Official Product Page

   
Part No. HSMS-285P-TR1
Description SILICON, ZERO BARRIER SCHOTTKY, HF-C BAND, MIXER DIODE

File Size 89.82K  /  12 Page

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Part No. 95278-101-42LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 42 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs    

Official Product Page

   
Part No. HSMS-285C-BLK
Description SILICON, UHF-C BAND, MIXER DIODE

File Size 527.17K  /  12 Page

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Part No. 75168-101-13LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled header, Through Hole, Single Row, 13 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

   
Part No. HSMS-2863-TR2
Description SILICON, UHF-C BAND, MIXER DIODE

File Size 196.27K  /  17 Page

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Amphenol Communications Solutions

Part No. 75168-101-36LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled header, Through Hole, Single Row, 36 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

For HSMS-8101 Found Datasheets File :: 150+       Page :: | 1 | <2> | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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