package case484-fbga pdf Datasheet P2 Description --- IC-ON-LINE


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package case484-fbga Datasheet PDF File

For package case484-fbga Found Datasheets File :: 150+ Page :: | 1 | <2> | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |

				Samsung Semiconductor Co., Ltd. SAMSUNG SEMICONDUCTOR CO. LTD. SAMSUNG[Samsung semiconductor] Samsung Electronic
Part No.	K4S51323PF-MF90 K4S51323PF-MF75 K4S51323PF-MF1L K4S51323PF-MEF90 K4S51323PF-MEF75 K4S51323P K4S51323PF-MEF1L K4S51323PF-MF750JR K4S51323PF-EF750 K4S51323PF-MF1L0 K4S51323PF-EF900
Description	16M X 32 SYNCHRONOUS DRAM, 7 ns, PBGA90 LEAD FREE, FBGA-90 16M X 32 SYNCHRONOUS DRAM, 7 ns, PBGA90 FBGA-90 16M X 32 SYNCHRONOUS DRAM, 6 ns, PBGA90 LEAD FREE, FBGA-90 16M X 32 SYNCHRONOUS DRAM, 6 ns, PBGA90 FBGA-90 4M x 32Bit x 4 Banks Mobile-SDRAM From old datasheet system
File Size	139.48K / 12 Page	View it Online	Download Datasheet

				Samsung Semiconductor Co., Ltd. SAMSUNG SEMICONDUCTOR CO. LTD. SAMSUNG[Samsung semiconductor] Samsung Electronic
Part No.	K4S56163PF K4S56163PF-F1L K4S56163PF-F90 K4S56163PF-RG K4S56163PF-RG_F90 K4S56163PF-RG_F1L K4S56163PF-RG_F75 K4S56163PF-RG/F90 K4S56163PF-RG/F1L K4S56163PF-RG/F75 K4S56163PF-RF750 K4S56163PF-BF900 K4S56163PF-RG750 K4S56163PF-BG750 K4S56163PF-RF900
Description	16M X 16 SYNCHRONOUS DRAM, 6 ns, PBGA54 LEAD FREE, FBGA-54 16M X 16 SYNCHRONOUS DRAM, 7 ns, PBGA54 LEAD FREE, FBGA-54 16M X 16 SYNCHRONOUS DRAM, 6 ns, PBGA54 FBGA-54 4M x 16Bit x 4 Banks Mobile SDRAM in 54FBGA 4米16 × 4银行4FBGA移动SDRAM CAP 47UF 350V ELECT EB SMD
File Size	111.59K / 12 Page	View it Online	Download Datasheet


Part No.	ST333S08PFM0 ST333S04PFM0
Description	Stratix GX FPGA 25K 4-FBGA Stratix GX FPGA 10K 8-FBGA 400V 518A逆变晶闸管采用TO - 209AE（至118）封
File Size	130.22K / 9 Page	View it Online	Download Datasheet

				Electronic Theatre Controls, Inc.
Part No.	BC204VI BC214K BC213K BC173C BC153 BC209C BC209B BC168B BC208B
Description	IC FLEX 6000 FPGA 10K 144-TQFP Programmable Logic IC; Logic Type:Programmable; No. of Macrocells:102; package/Case:144-TQFP; Leaded Process Compatible:No; Number of Circuits:1728 Programmable Logic IC; Logic Type:Programmable; No. of Macrocells:66; package/Case:100-TQFP; Leaded Process Compatible:No; Number of Circuits:576 FPGA Logic IC; Logic Type:Programmable; No. of Macrocells:147; package/Case:208-PQFP; Leaded Process Compatible:No; Number of Circuits:4992; Peak Stratix II FPGA 180K FBGA-1020 Cyclone FPGA 6K FBGA-256 IC APEX 20KE FPGA 400K Cyclone FPGA 3K TQFP-144 晶体管\|晶体管\|叩\| 20V的五（巴西）总裁\| 100mA的一（c）\|06
File Size	430.72K / 4 Page	View it Online	Download Datasheet

				http:// Cypress Semiconductor, Corp.
Part No.	CY7C67200-BAXIT CY7C67200-48BAXI CY7C6720011 CY3663
Description	EZ-OTG Programmable USB On-The-Go package option: 48-pin FBGA EZ-OTGProgrammable USB On-The-Go UNIVERSAL SERIAL BUS CONTROLLER, BGA48
File Size	721.70K / 78 Page	View it Online	Download Datasheet

				ALPS Electric Co., Ltd.
Part No.	ST49C101A-07 ST49C101A-09 ST49C101A-01 ST49C101A-03 ST49C101A-05 ST49C101A-10 ST49C101A-15 ST49C101A-06
Description	MAX II CPLD 240 LE 100-MBGA MAX II CPLD 2210 LE 256-FBGA MAX II CPLD 570 LE 256-FBGA MAX II CPLD 2210 LE 324-FBGA MAX II CPLD 570 LE 100-FBGA MAX II CPLD 240 LE 100-FBGA 变频
File Size	314.23K / 9 Page	View it Online	Download Datasheet


Part No.	ST415 ST413 ST416
Description	Cyclone II FPGA 35K FBGA-484 IC ACEX 1K FPGA 50K 208-PQFP IC ACEX 1K FPGA 100K 256-FBGA
File Size	248.65K / 3 Page	View it Online	Download Datasheet

				Samsung Semiconductor Co., Ltd. SAMSUNG SEMICONDUCTOR CO. LTD. SAMSUNG[Samsung semiconductor] Samsung Electronic
Part No.	K4S56323PF-FG K4S56323PF-F90 K4S56323PF-F75 K4S56323PF-F1L K4S56323PF K4S56323PF-FG1L0 K4S56323PF-HG750 K4S56323PF-FG900 K4S56323PF-FF900 K4S56323PF-HF750
Description	2M x 32Bit x 4 Banks Mobile SDRAM in 90FBGA 2米x 32Bit的4银行0FBGA移动SDRAM 8M X 32 SYNCHRONOUS DRAM, 6 ns, PBGA90 LEAD FREE, FBGA-90 8M X 32 SYNCHRONOUS DRAM, 7 ns, PBGA90 FBGA-90
File Size	140.08K / 12 Page	View it Online	Download Datasheet

				Samsung Electronic Samsung Semiconductor Co., Ltd. Data Device, Corp. SAMSUNG SEMICONDUCTOR CO. LTD. SAMSUNG[Samsung semiconductor]
Part No.	K4M28163PF K4M28163PF-F75 K4M28163PF-R K4M28163PF-RBGF75 K4M28163PF-RG K4M28163PF-RF750 K4M28163PF-BF900 K4M28163PF-BF750 K4M28163PF-BG750
Description	2M x 16Bit x 4 Banks Mobile SDRAM in 54FBGA 200万16 × 4银行4FBGA移动SDRAM 8M X 16 SYNCHRONOUS DRAM, 6 ns, PBGA54 0.80 MM PITCH, LEAD FREE, FBGA-54 8M X 16 SYNCHRONOUS DRAM, 7 ns, PBGA54 0.80 MM PITCH, LEAD FREE, FBGA-54 8M X 16 SYNCHRONOUS DRAM, 6 ns, PBGA54 0.80 MM PITCH, FBGA-54
File Size	111.60K / 12 Page	View it Online	Download Datasheet

				Seiko NPC Corporation
Part No.	CF5015 CF5015AL2 CF5015AL1-2 CF5015AL2-2
Description	Low Power SRAM; Organization (word): 1M; Organization (bit): x 16; Memory capacity (bit): 16M; Access time (ns): 55; Supply voltage (V): 2.7 to 3.6; Operating temperature (°C): 0 to 70; package: FBGA (48) Low Power SRAM; Organization (word): 1M; Organization (bit): x 16; Memory capacity (bit): 16M; Access time (ns): 85; Supply voltage (V): 2.7 to 3.6; Operating temperature (°C): -40 to 85; package: FBGA (48) Low Power SRAM; Organization (word): 1M; Organization (bit): x 16; Memory capacity (bit): 16M; Access time (ns): 70; Supply voltage (V): 2.7 to 3.6; Operating temperature (°C): 0 to 70; package: FBGA (48) Low Power SRAM; Organization (word): 1M; Organization (bit): x 16; Memory capacity (bit): 16M; Access time (ns): 85; Supply voltage (V): 2.7 to 3.6; Operating temperature (°C): 0 to 70; package: FBGA (48) Low Power SRAM; Organization (word): 1M; Organization (bit): x 16; Memory capacity (bit): 16M; Access time (ns): 70; Supply voltage (V): 2.7 to 3.6; Operating temperature (°C): -40 to 85; package: FBGA (48) Low Power SRAM; Organization (word): 1M; Organization (bit): x 16; Memory capacity (bit): 16M; Access time (ns): 85; Supply voltage (V): 2.7 to 3.6; Operating temperature (°C): 0 to 70; package: FBGA (48) Low Power SRAM; Organization (word): 1M; Organization (bit): x 16; Memory capacity (bit): 16M; Access time (ns): 70; Supply voltage (V): 2.7 to 3.6; Operating temperature (°C): 0 to 70; package: FBGA (48) Low Power SRAM; Organization (word): 1M; Organization (bit): x 16; Memory capacity (bit): 16M; Access time (ns): 70; Supply voltage (V): 2.7 to 3.6; Operating temperature (°C): -40 to 85; package: FBGA (48)
File Size	94.87K / 10 Page	View it Online	Download Datasheet

For package case484-fbga Found Datasheets File :: 150+ Page :: | 1 | <2> | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |

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