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For preforms Found Datasheets File :: 398 Search Time::1.657ms
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				Cree, Inc
Part No.	C460EZ700-SXX000 C450EZ700-SXX000 CXXXEZ700-SXX000 C470EZ700-SXX000
OCR Text	...e epoxy, solder paste or solder preforms, in addition to using the flux eutectic method. These vertically structured, low forward voltage LED chips are approximately 100 microns in height. Cree's EZTM chips are tested for conformity to opti...
Description	Cree? EZ700 LED
File Size	315.48K / 6 Page	View it Online	Download Datasheet

				Cree, Inc
Part No.	C460EZ1000-SXX000 C470EZ1000-SXX000 C450EZ1000-SXX000 CXXXEZ1000-SXX000 C527EZ1000-SXX000
OCR Text	...e epoxy, solder paste or solder preforms, as well as the flux eutectic method. These vertically structured, low forward voltage LED chips are approximately 100 microns in height. Cree's EZTM chips are tested for conformity to optical and el...
Description	Cree? EZ1000 LEDs
File Size	244.01K / 6 Page	View it Online	Download Datasheet

				Tyco Electronics
Part No.	371176-000
OCR Text	...sleeving and one or more solder preforms. These devices reduce to predetermined diameters upon the proper application of heat, and form insulated, soldered connections between wire or cable conductors. These devices are heat-shrinkable sold...
Description	SolderSleeve Wire Splices; D-1744-02 ( Raychem )
File Size	129.66K / 11 Page	View it Online	Download Datasheet

				Cree, Inc
Part No.	C460EZ600-SXX000 C450EZ600-SXX000 CXXXEZ400-SXX000
OCR Text	...e epoxy, solder paste or solder preforms, as well as the flux eutectic method. These vertically structured, low forward voltage LED chips are approximately 100 microns in height. Cree's EZTM chips are tested for conformity to optical and el...
Description	Cree? EZ400 LED
File Size	235.00K / 5 Page	View it Online	Download Datasheet

				Cree, Inc Marktech Corporate
Part No.	C450EZ700-0312-2 C460EZ700-0312-2 C470EZ700-0312-2 C527EZ700-0201-2 C527EZ700-0202-2 C527EZ700-0203-2 CXXXEZ700-SXX000-2 C470EZ700-S20000-2 EZ700-15 C527EZ700-0204-2 C527EZ700-0206-2 C527EZ700-0205-2 C527EZ700-0208-2 C527EZ700-0207-2 C527EZ700-0209-2 C527EZ700-0210-2 C527EZ700-0211-2 C527EZ700-0212-2 C470EZ700-0302-2 C470EZ700-0303-2 C470EZ700-0304-2 C470EZ700-0301-2 C450EZ700-0305-2 C460EZ700-0305-2 C450EZ700-S24000-2 C460EZ700-S24000-2
OCR Text	...ctive epoxy, solder paste or preforms, or flux eutectic attach ? low forward voltage C 3.6 v typical at 350 ma ? single wire bond structure ? dielectric passivation across epi surface applications ? general illumination ...
Description	EZBright Power Chip LED Rf Performance Low Forward Voltage ?3.6 V Typical at 350 Cree EZ700 Gen II LED
File Size	174.96K / 5 Page	View it Online	Download Datasheet

				CREE[Cree, Inc]
Part No.	CXXXEZ700-SXX000 C450EZ700-SXX000 C460EZ700-SXX000 C470EZ700-SXX000
OCR Text	...e epoxy, solder paste or solder preforms, in addition to using the flux eutectic method. These vertically structured, low forward voltage LED chips are approximately 100 microns in height. Cree's EZTM chips are tested for conformity to opti...
Description	Cree㈢ EZ700⑩ LED
File Size	308.00K / 6 Page	View it Online	Download Datasheet

				CREE[Cree, Inc]
Part No.	CXXXEZ400-SXX000 C450EZ600-SXX000 C460EZ600-SXX000
OCR Text	...e epoxy, solder paste or solder preforms, as well as the flux eutectic method. These vertically structured, low forward voltage LED chips are approximately 100 microns in height. Cree's EZTM chips are tested for conformity to optical and el...
Description	Cree㈢ EZ400⑩ LED
File Size	229.16K / 5 Page	View it Online	Download Datasheet

				CREE[Cree, Inc]
Part No.	CXXXEZ1000-SXX000 C450EZ1000-SXX000 C460EZ1000-SXX000 C470EZ1000-SXX000 C527EZ1000-SXX000
OCR Text	...e epoxy, solder paste or solder preforms, as well as the flux eutectic method. These vertically structured, low forward voltage LED chips are approximately 100 microns in height. Cree's EZTM chips are tested for conformity to optical and el...
Description	Cree㈢ EZ1000⑩ LEDs
File Size	238.15K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corpo... Hittite Microwave Corporation
Part No.	HMC258
OCR Text	... die mounted with AuSn eutectic preforms or with electrically conductive epoxy. The mounting surface should be clean and flat. Eutectic Die Attach: A 80/20 gold tin preform is recommended with a work surface temperature of 255 C and a tool ...
Description	GaAs MMIC SUB-HARMONICALLY PUMPED MIXER, 14 - 21 GHz GaAs MMIC SUB-HARMONICALLY PUMPED MIXER/ 14 - 21 GHz
File Size	198.60K / 6 Page	View it Online	Download Datasheet

				美国讯泰微波有限公司上海代表 Hittite Microwave Corporation
Part No.	HMC259
OCR Text	... die mounted with AuSn eutectic preforms or with electrically conductive epoxy. The mounting surface should be clean and flat. Eutectic Die Attach: A 80/20 gold tin preform is recommended with a work surface temperature of 255 deg. C and a ...
Description	GaAs MMIC SUB-HARMONICALLY PUMPED MIXER 28 - 40 GHz
File Size	164.56K / 6 Page	View it Online	Download Datasheet

For preforms Found Datasheets File :: 398 Search Time::1.657ms
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