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  ramp soak Datasheet PDF File

For ramp soak Found Datasheets File :: 351    Search Time::1.297ms    
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    RMPA1966

Fairchild Semiconductor
Part No. RMPA1966
OCR Text ...t recommended. Reflow Profile * ramp-up: During this stage the solvents are evaporated from the solder paste. Care should be taken to preven...soak: The soak temperature stage serves two purposes; the flux is activated and the board and device...
Description RMPA1966 I-Lo TM WCDMA Band II Power Amplifier Module, 1850-1910 MHz
RMPA1966 I-Lo TM WCDMA Band II Power Amplifier Module, 1850-1910 MHz

File Size 504.07K  /  7 Page

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    FAIRCHILD SEMICONDUCTOR CORP
FAIRCHILD[Fairchild Semiconductor]
Part No. RMPA2263
OCR Text ...t recommended. Reflow Profile * ramp-up: During this stage the solvents are evaporated from the solder paste. Care should be taken to preven...soak: The soak temperature stage serves two purposes; the flux is activated and the board and device...
Description WCDMA Power Amplifier Module 1920-1980 MHz

File Size 108.75K  /  7 Page

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    RMPA1963

Fairchild Semiconductor Corporation
FAIRCHILD[Fairchild Semiconductor]
Part No. RMPA1963
OCR Text ...t recommended. Reflow Profile * ramp-up: During this stage the solvents are evaporated from the solder paste. Care should be taken to preven...soak: The soak temperature stage serves two purposes; the flux is activated and the board and device...
Description US-PCS CDMA, CDMA2000-1X and WCDMA Power Amplifier Module

File Size 99.21K  /  7 Page

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    EDS11-164A

Fuji Electric
Part No. EDS11-164A
OCR Text ...trol, pid control or 8-step ramp/soak function, using thermocouple, resistance bulb or dc1 to 5v signal as input. though small-sized, it can be equipped with a variety of functions. features 1. pid with auto-tuning, pid se...
Description PX series Digital temperature Controller Socket Type MICRO-CONTROLLER X (48mm×48mm) MICRO-CONTROLLER X

File Size 410.42K  /  8 Page

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    FAIRCHILD[Fairchild Semiconductor]
Part No. RMPA0965
OCR Text ...t recommended. Reflow Profile * ramp-up: During this stage the solvents are evaporated from the solder paste. Care should be taken to preven...soak: The soak temperature stage serves two purposes; the flux is activated and the board and device...
Description CDMA and CDMA2000-1X PowerEdge Power Amplifier Module

File Size 513.56K  /  8 Page

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    RMPA1765 RMPA176506

FAIRCHILD[Fairchild Semiconductor]
Part No. RMPA1765 RMPA176506
OCR Text ...t recommended. Reflow Profile * ramp-up: During this stage the solvents are evaporated from the solder paste. Care should be taken to preven...soak: The soak temperature stage serves two purposes; the flux is activated and the board and device...
Description K-PCS, CDMA, CDMA2000-1X and WCDMA Power Edge Power Amplifier Module

File Size 538.15K  /  8 Page

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    Edison
Part No. ET-3528A-111W ET-3528B-111W
OCR Text ...e (Tsmin to Tsmax) (ts) Average ramp-up rate (Tsmax to Tp) Liquidous temperature (TL) Time at liquidous (tL) Peak package body temperature (Tp)* Classification temperature (Tc) Time (tp)** within 5 C of the specified classification temperat...
Description ET-3528R/T/B/A-111W

File Size 671.33K  /  20 Page

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    AN610

Vishay Siliconix
Part No. AN610
OCR Text ...d part pick-and-place machines. ramp-soak-spike (RSS) profiles for both varieties of solder pastes were used. First, a visual inspection was used to check for obviously faulty solder joints. Both 5DX laminography X-ray and 2DX transmission ...
Description PolarPAK Solder Joint Reliability Based on Thermal Fatigue IPC-9701

File Size 1,196.47K  /  17 Page

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    Vishay Intertechnology,Inc.
Part No. AN610
OCR Text ...d part pick-and-place machines. ramp-soak-spike (RSS) profiles for both varieties of solder pastes were used. First, a visual inspection was used to check for obviously faulty solder joints. Both 5DX laminography X-ray and 2DX transmission ...
Description PolarPAK Solder Joint Reliability Based on Thermal Fatigue IPC-9701

File Size 1,202.85K  /  17 Page

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    FAIRCHILD[Fairchild Semiconductor]
Part No. RMPA1759
OCR Text ...recommended. * Reflow Profile - ramp-up: During this stage the solvents are evaporated from the solder paste. Care should be taken to preven...soak: The soak temperature stage serves two purposes; the flux is activated and the board and device...
Description 3.4V Korean PCS CDMA PA Module
Korean-PCS PowerEdge Power Amplifier Module

File Size 536.06K  /  8 Page

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For ramp soak Found Datasheets File :: 351    Search Time::1.297ms    
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