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sot536-1 Datasheet PDF File

For sot536-1 Found Datasheets File :: 36 Search Time::2.469ms
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					Philips Semiconductors
Part No.	SSTUH32864
OCR Text	... balls; body 13.5 5.5 1.05 mm sot536-1 sstuh32864ec snpb solder ball compound lfbga96 plastic low pro?le ?ne-pitch ball grid array package; 96 balls; body 13.5 5.5 1.05 mm sot536-1 9397 750 14137 ? koninklijke philips electronics n....
Description	1.8 V high output drive configurable registered buffer
File Size	137.98K / 20 Page	View it Online	Download Datasheet

					Philips Semiconductors
Part No.	SSTU32866
OCR Text	...e (snagcu solder ball compound) sot536-1 sstu32866ec lfbga96 plastic low pro?le ?ne-pitch ball grid array package; 96 balls; body 13.5 5.5 1.05 mm snpb solder ball compound sot536-1 table 2: ball mapping, 1:1 register (c0 = 0, c1 = 0) 96-...
Description	1.8V 25-bit 1:1 or 14-bit 1:2 confgurable registered buffer
File Size	176.43K / 27 Page	View it Online	Download Datasheet

					NXP Semiconductors
Part No.	SSTUB32866EC/G SSTUB32866EC/S
OCR Text	...-pitch ball grid array package; sot536-1 ball compound) 96 balls; body 13.5 x 5.5 x 1.05 mm Pb-free (SnAgCu solder LFBGA96 plastic low profile fine-pitch ball grid array package; sot536-1 ball compound) 96 balls; body 13.5 x 5.5 x 1.05 mm ...
Description	1.8 V 25-bit 1 : 1 or 14-bit 1 : 2 configurable registered buffer with parity for DDR2-800 RDIMM applications
File Size	146.12K / 29 Page	View it Online	Download Datasheet

					NXP Semiconductors N.V. Philips
Part No.	SSTU32864EC SSTU32864EC/G SSTU32864EC/G557 SSTU32864EC/G-S SSTU32864EC/G-T SSTU32864EC/G518 SSTU32864EC/G551
OCR Text	...-pitch ball grid array package; sot536-1 96 balls; body 13.5 x 5.5 x 1.05 mm plastic low profile fine-pitch ball grid array package; sot536-1 96 balls; body 13.5 x 5.5 x 1.05 mm 9397 750 14092 (c) Koninklijke Philips Electronics N.V. ...
Description	1.8 V configurable registered buffer for DDR2 RDIMM applications
File Size	106.08K / 21 Page	View it Online	Download Datasheet

					Philips NXP Semiconductors N.V.
Part No.	SSTUH32864 SSTUH32864EC SSTUH32864EC_G SSTUH32864EC/G SSTUH32864EC/G-T
OCR Text	...-pitch ball grid array package; sot536-1 96 balls; body 13.5 x 5.5 x 1.05 mm plastic low profile fine-pitch ball grid array package; sot536-1 96 balls; body 13.5 x 5.5 x 1.05 mm 9397 750 14137 (c) Koninklijke Philips Electronics N.V. ...
Description	1.8 V high output drive configurable registered buffer for DDR2 RDIMM applications
File Size	101.51K / 20 Page	View it Online	Download Datasheet

					NXP Semiconductors N.V.
Part No.	SSTUA32864 SSTUA32864EC SSTUA32864EC_G SSTUA3286407 SSTUA32864EC/G SSTUA32864EC/G-T SSTUA32864EC/G518
OCR Text	...dy 13.5 x 5.5 x 1.05 mm Version sot536-1 sot536-1 SSTUA32864_2 (c) NXP B.V. 2007. All rights reserved. Product data sheet Rev. 02 -- 9 March 2007 2 of 20 NXP Semiconductors SSTUA32864 1.8 V configurable registered buff...
Description	1.8 V configurable registered buffer for DDR2-667 RDIMM applications
File Size	108.39K / 20 Page	View it Online	Download Datasheet

					NXP Semiconductors
Part No.	SSTUA32866 SSTUA32866EC SSTUA32866EC_G SSTUA32866EC/G
OCR Text	...-pitch ball grid array package; sot536-1 ball compound) 96 balls; body 13.5 x 5.5 x 1.05 mm SnPb solder ball compound LFBGA96 plastic low profile fine-pitch ball grid array package; sot536-1 96 balls; body 13.5 x 5.5 x 1.05 mm 5. Functio...
Description	1.8 V 25-bit 1 : 1 or 14-bit 1 : 2 configurable registered buffer with parity for DDR2-667 RDIMM applications
File Size	145.00K / 28 Page	View it Online	Download Datasheet

					NXP Semiconductors
Part No.	SSTUP32866EC_G SSTUP32866EC_S SSTUP32866EC/G SSTUP32866EC/S
OCR Text	...-pitch ball grid array package; sot536-1 ball compound) 96 balls; body 13.5 x 5.5 x 1.05 mm Pb-free (SnAgCu solder LFBGA96 plastic low profile fine-pitch ball grid array package; sot536-1 ball compound) 96 balls; body 13.5 x 5.5 x 1.05 mm ...
Description	1.8 V 25-bit 1 : 1 or 14-bit 1 : 2 configurable registered buffer with parity and programmable output for DDR2-800 RDIMMs
File Size	151.97K / 31 Page	View it Online	Download Datasheet

					Philips NXP Semiconductors N.V.
Part No.	SSTU32866EC_G SSTU32866EC SSTU32866EC/G SSTU32866EC/G557 SSTU32866EC/G551 SSTU32866EC/G518 SSTU32866EC/G-S SSTU32866EC/G-T
OCR Text	...-pitch ball grid array package; sot536-1 96 balls; body 13.5 x 5.5 x 1.05 mm plastic low profile fine-pitch ball grid array package; sot536-1 96 balls; body 13.5 x 5.5 x 1.05 mm 9397 750 14181 (c) Koninklijke Philips Electronics N.V. ...
Description	1.8 V 25-bit 1:1 or 14-bit 1:2 configurable registered buffer with parity for DDR2 RDIMM applications
File Size	144.98K / 29 Page	View it Online	Download Datasheet

					NXP Semiconductors N.V.
Part No.	SSTUB32866EC_G SSTUB32866EC_S SSTUB32866 SSTUB3286610 SSTUB32866EC/G-T SSTUB32866EC/G518
OCR Text	...-pitch ball grid array package; sot536-1 ball compound) 96 balls; body 13.5 x 5.5 x 1.05 mm Pb-free (SnAgCu solder LFBGA96 plastic low profile fine-pitch ball grid array package; sot536-1 ball compound) 96 balls; body 13.5 x 5.5 x 1.05 mm ...
Description	1.8 V 25-bit 1 : 1 or 14-bit 1 : 2 configurable registered buffer with parity for DDR2-800 RDIMM applications
File Size	227.33K / 30 Page	View it Online	Download Datasheet

For sot536-1 Found Datasheets File :: 36 Search Time::2.469ms
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