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Texas Instruments |
Part No. |
LMV1090TLX/NOPB
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Description |
Dual Input, Far Field Noise Suppression Microphone Amplifier 16-DSBGA -40 to 85
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Tech specs |
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Official Product Page
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Texas Instruments |
Part No. |
LMV1091TMX/NOPB
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Description |
Dual Input, Far Field Noise Suppression Microphone Amplifier 25-DSBGA -40 to 85
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Tech specs |
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Official Product Page
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Texas Instruments |
Part No. |
LMV1091TM/NOPB
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Description |
Dual Input, Far Field Noise Suppression Microphone Amplifier 25-DSBGA -40 to 85
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Tech specs |
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Official Product Page
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Texas Instruments |
Part No. |
LMV1090TL/NOPB
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Description |
Dual Input, Far Field Noise Suppression Microphone Amplifier 16-DSBGA -40 to 85
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Tech specs |
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Official Product Page
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Texas Instruments |
Part No. |
LMV1099TLX/NOPB
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Description |
Uplink Far Field Noise Suppression; Downlink SNR Enhancing Mic Amp w/ Earpiece Driver 25-DSBGA -40 to 85
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Tech specs |
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Official Product Page
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Texas Instruments |
Part No. |
LMV1099TL/NOPB
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Description |
Uplink Far Field Noise Suppression; Downlink SNR Enhancing Mic Amp w/ Earpiece Driver 25-DSBGA -40 to 85
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
14-56-2222 A-70400-0686
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Description |
2.54mm (.100) Pitch SL?/a> Insulation Displacement Connector Assembly, Female, Single Row, Version G, Positive Lock, Wire Size 24, 0.38μm (15μ) Gold (Au) 2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Female, Single Row, Version G, Positive Lock, Wire Size 24, 0.38μm (15μ) Gold (Au)
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File Size |
166.47K /
3 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
10131319-222220ULF
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Description |
Minitek®Pwr 4.2 High Current Connector System, Dual Row, Vertical Through Hole Header, 100u\\ Matte Tin plating, Black Color, 22 Positions, Non GW Compatible LCP, Tape and Reel without cap.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
10131319-22222G0LF
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Description |
Minitek® Pwr 4.2 HCC, Dual Row, Vertical Through Hole Header, 100u\\ Matte Tin overall plating, Black Color, 22 Positions, LCP, GW Compatible, Tray Packing.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
68022-222HLF
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Description |
BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 22 Positions, 2.54 mm (0.100in)Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
10131319-2222200LF
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Description |
Minitek® Pwr 4.2 HCC, Dual Row, Vertical Through Hole Header, 100u\\ Matte Tin overall plating, Black Color, 22 Positions, LCP, Non GW Compatible, Tray Packing.
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Tech specs |
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Official Product Page
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Bom2Buy.com

Price and Availability
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