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  2021-1314-02 Datasheet PDF File

For 2021-1314-02 Found Datasheets File :: 150+       Page :: | 1 | 2 | <3> | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    Molex
Part No. 22-01-2021
Description Header Connector,Cable Mnt,PLUG,2 Contacts,SKT,0.1 Pitch,IDC Terminal

File Size 26.45K  /  1 Page

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Amphenol Communications Solutions

Part No. 131-4114-11D
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 4 Column, Open Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    PMC-2021

PIC GmbH
Part No. PMC-2021
Description High Power Reed Switch

File Size 20.54K  /  1 Page

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Amphenol Communications Solutions

Part No. 131-4416-11D
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 6 Column, Right End Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    DATA DELAY DEVICES INC
Part No. 2021-150
Description PASSIVE DELAY LINE, TRUE OUTPUT, PSIP3

File Size 52.86K  /  1 Page

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Amphenol Communications Solutions

Part No. 131-4118-11H
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 8 Column, Open Wall, Backplane Module, 1.5mm Wipe, APP.
Tech specs    

Official Product Page

    TY Semiconductor Co., Ltd
Part No. 2SA1314
Description Low Saturation Voltage VCE(sat) = -0.5V (max) (IC = -2A, IB = -50mA) Small Flat Package

File Size 391.92K  /  2 Page

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Amphenol Communications Solutions

Part No. 131-4514-11H
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 4 Column, Left Polarized, Backplane Module, 1.5mm Wipe, APP.
Tech specs    

Official Product Page

    CN13144

Cree, Inc
Part No. CN13144
Description Mira series

File Size 140.74K  /  4 Page

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Amphenol Communications Solutions

Part No. 131-4216-21D
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 6 Column, Double End Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    EIM1314-4

Excelics Semiconductor, Inc.
Part No. EIM1314-4
Description 13.75-14.50GHz Multi-Stage Power Amplifier

File Size 132.10K  /  3 Page

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Amphenol Communications Solutions

Part No. 131-4518-21D
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 8 Column, Left Polarized, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
Part No. FLM1314-8F
Description X, Ku-Band Internally Matched FET

File Size 292.61K  /  4 Page

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Amphenol Communications Solutions

Part No. 131-4314-21H
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 4 Column, Left End Wall, Backplane Module, 2.25mm Wipe, APP.
Tech specs    

Official Product Page

    SW1314E-V

AUK corp
Part No. SW1314E-V
Description Chip LED Lamp

File Size 264.14K  /  6 Page

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Amphenol Communications Solutions

Part No. 131-4616-21H
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 6 Column, Right Polarized, Backplane Module, 2.25mm Wipe, APP.
Tech specs    

Official Product Page

    SW1314E-H

AUK corp
Part No. SW1314E-H
Description White Chip LED

File Size 170.63K  /  6 Page

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Amphenol Communications Solutions

Part No. 131-4316-11D
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 6 Column, Left End Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    TIM1314-9L

Toshiba Semiconductor
Part No. TIM1314-9L
Description IM3(Min.)=−25dBc at Po=33dBm Single Carrier Level

File Size 150.95K  /  4 Page

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Amphenol Communications Solutions

Part No. 131-4618-11D
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 8 Column, Right Polarized, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

For 2021-1314-02 Found Datasheets File :: 150+       Page :: | 1 | 2 | <3> | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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