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  2709 Datasheet PDF File

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    TB62709F TB62709N TB62709

TOSHIBA[Toshiba Semiconductor]
Part No. TB62709F TB62709N TB62709
Description TOSHIBA Bi-CMOS Integrated Circuit Silicon Monolithic
7-SEGMENT DRIVERS WITH BUILT-IN DECODERS (COMMON ANODE CAPABILITY, MAXIMUM 4-DIGIT CONTROL)

File Size 633.23K  /  24 Page

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Amphenol Communications Solutions

Part No. 77311-127-09LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 09 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    TB62709FG

Toshiba Semiconductor
Part No. TB62709FG
Description 7-SEGMENT DRIVERS

File Size 1,193.64K  /  26 Page

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Amphenol Communications Solutions

Part No. MDB227093205BP
Description Rugged D-Sub Accessory, Input Output Connectors, Dust Cover, for 9 Pin Harsh D-sub
Tech specs    

Official Product Page

    Toshiba Corporation
Part No. TB62709FG
Description 7−SEGMENT DRIVERS WITH BUILT−IN DECODERS (COMMON ANODE CAPABILITY, MAXIMUM 4−DIGIT CONTROL)

File Size 570.57K  /  29 Page

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Amphenol Communications Solutions

Part No. 77311-827-09LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 09 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    2SK312709

Toshiba Semiconductor
Part No. 2SK312709
Description Chopper Regulator, DC-DC Converter and Motor Drive Applications

File Size 127.50K  /  3 Page

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Amphenol Communications Solutions

Part No. 77311-427-09LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 09 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    UPC2709T UPC2709TB UPC2709TB-E3

NEC Corp.
California Eastern Labs
NEC[NEC]
Part No. UPC2709T UPC2709TB UPC2709TB-E3
Description 5 V/ SUPER MINIMOLD SILICON MMIC MEDIUM OUTPUT POWER AMPLIFIER
5 V, SUPER MINIMOLD SILICON MMIC MEDIUM OUTPUT POWER AMPLIFIER

File Size 93.08K  /  16 Page

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Texas Instruments

Part No. UC2709DW
Description Inverting High-Speed MOSFET Drivers 16-SOIC -40 to 85
Tech specs    

Official Product Page

    0001.2704.XX 0001.2705.XX 0001.2706.XX 0001.2707.XX 0001.2708.XX 0001.2709.XX 0001.2710.XX 0001.2711.XX 0001.2712.XX 000

Schurter Inc.
SCHURTER AG
Part No. 0001.2704.XX 0001.2705.XX 0001.2706.XX 0001.2707.XX 0001.2708.XX 0001.2709.XX 0001.2710.XX 0001.2711.XX 0001.2712.XX 0001.2713.XX 0001.2714.XX 0001.2715.XX 0001.2716.XX SMD-SPT 0001.2712.22
Description Surface Mount Fuse, 5 x 20 mm, Time-Lag T, H, 250 VAC, Au plating
FUSE 6.3A 250V 5X20T-LAG SMD TIME LAG BLOW ELECTRIC FUSE, 6.3A, 250VAC, 150VDC, 1500A (IR), SURFACE MOUNT

File Size 397.10K  /  3 Page

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Texas Instruments

Part No. UC2709N
Description Inverting High-Speed MOSFET Drivers 8-PDIP -40 to 85
Tech specs    

Official Product Page

    51227-0900 0512270900

Molex Electronics Ltd.
Part No. 51227-0900 0512270900
Description 2.00mm (.079) Pitch Wire-to-Wire Plug Housing, Positive Lock, 9 circuits
2.00mm (.079") Pitch Wire-to-Wire Plug Housing, Positive Lock, 9 circuits

File Size 109.46K  /  2 Page

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    53627-0974 0536270974

Molex Electronics Ltd.
Part No. 53627-0974 0536270974
Description 0.635mm (.025) Pitch SlimStack Header, Surface Mount, Dual Row, VerticalStacking, 10.00 and 16.00mm (.394 and .630) Stacking Heights, Lead-free, 90Circuits, with Embossed Tape with Cover Packaging

File Size 444.59K  /  6 Page

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    49627-0982 0496270982

Molex Electronics Ltd.
Part No. 49627-0982 0496270982
Description 4.20mm (.165) Wire-to-Wire Lower TPA for Female Housing, 9 Circuits

File Size 91.75K  /  2 Page

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    C61157-A7-A56 F61074-V8070-Z000 R2709

http://
EPCOS
Part No. C61157-A7-A56 F61074-V8070-Z000 R2709
Description SAW Components Resonator

File Size 103.17K  /  4 Page

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