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Rochester Electronics LLC |
| Part No. |
EP1800ILC-70
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| Description |
EP1800 - Classic Family EPLD
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| Tech specs |
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Official Product Page
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Rochester Electronics LLC |
| Part No. |
EP1800GM-75/B
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| Description |
EP1800 - Classic Family EPLD
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10120818-001CLF
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| Description |
SAS 3.0 Connectors, Storage & Server System, Receptacle, Vertical, Surface Mount, 29 Positions, 12Gb/s.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10127718-002PLF
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| Description |
Minitek® Pwr 3.0, Receptacle Terminal, Gold Flash, Preplating.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
71918-008LF
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| Description |
Quickie Eject Latch Shrouded Header, Through Hole, Vertical, Double Row, 8 Positions, 2.54mm (0.100in) Pitch
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0736443009 73644-3009
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| Description |
2.00mm (.079") Pitch HDM庐 Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location A, Polarizing Key Position E, 144 Circuits
2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location A, Polarizing Key Position E, 144 Circuits
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| File Size |
174.33K /
4 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
54121-809071800LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 7 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
87180-086LF
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| Description |
Modular Jack, CAT 3, Low Profile, 8P6C, Right Angle, Through Mount, Without Shield, Snap Peg, 1 Port
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0736443000 73644-3000
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| Description |
2.00mm (.079") Pitch HDM庐 Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position A, 144 Circuits
2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position A, 144 Circuits
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| File Size |
164.67K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
54242-108261800LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 26 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0736443001 73644-3001
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| Description |
2.00mm (.079") Pitch HDM庐 Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location A, Polarizing Key Position A, 144 Circuits
2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location A, Polarizing Key Position A, 144 Circuits
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| File Size |
174.87K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
54122-110161800LF
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| Description |
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 16 position, 2.54mm (0.100in) pitch
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54122-109141800LF
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| Description |
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 14 position, 2.54mm (0.100in) pitch
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| Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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