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Amphenol Communications Solutions |
Part No. |
68464-408HLF
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Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 8 Positions, 2.54 mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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SANYO
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Part No. |
2SA1784 2SC4644
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Description |
PNP Epitaxial Planar Silicon Transistor High Voltage Driver Applications NPN Triple Diffused Planar Silicon Transistor High Voltage Driver Applications
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File Size |
122.10K /
4 Page |
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it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
68464-432HLF
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Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 32 Positions, 2.54 mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
68464-454HLF
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Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 54 Positions, 2.54 mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
10135584-644402LF
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Description |
Bergstak® 0.80mm Pitch, Board to Board Vertical Header, Dual Row, 64 Positions, 0.80mm (0.031in) Pitch.
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Tech specs |
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Official Product Page
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Sensitron Semiconductor
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Part No. |
SHD114644B
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Description |
HERMETIC POWER SCHOTTKY RECTIFIER 200•C Maximum Operation Temperature 120 A, SILICON, RECTIFIER DIODE
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File Size |
85.21K /
4 Page |
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it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
68464-414HLF
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Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 14 Positions, 2.54 mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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TI store
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Part No. |
TMS464409P
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Description |
<font color=red>[Old version datasheet]</font> 16 777 216 BY 4-BIT EXTENDED DATA OUT DYNAMIC RANDOM-ACCESS MEMORIES
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File Size |
522.98K /
33 Page |
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it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
68464-436HLF
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Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 36 Positions, 2.54 mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
68464-458HLF
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Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 58 Positions, 2.54 mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
68464-410HLF
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Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 10 Positions, 2.54 mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
68464-434HLF
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Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 34 Positions, 2.54 mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
70246-4401 0702464401
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Description |
2.54mm (.100) Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 44Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating 2.54mm (.100") Pitch C-Grid庐 Header, Low Profile, Dual Row, Vertical, Shrouded, 44Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
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File Size |
175.94K /
4 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
68464-456HLF
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Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 56 Positions, 2.54 mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Price and Availability
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