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Molex Electronics Ltd.
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| Part No. |
A-70567-0015 0015800341
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 34 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 34 Circuits, Tin (Sn) Plating
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| File Size |
1,218.42K /
7 Page |
View
it Online |
Download Datasheet
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Amphenol Cables on Demand |
| Part No. |
CS-VHDCIMX200-008
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| Description |
Amphenol CS-VHDCIMX200-008 VHDCI SCSI (SCSI-5) LVD/SE Cable - .8mm 68-pin VHDCI SCSI Male to Male 8m
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
20021121-00008T8LF
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| Description |
Minitek127®, Board to Board connector, Unshrouded vertical header, Surface Mount, Double Row, 8Positions, 1.27mm (0.5inch) pitch.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
20021121-00086T4LF
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| Description |
Minitek127®, Board to Board connector, Unshrouded vertical header, Surface Mount, Double Row, 86Positions, 1.27mm (0.5inch) pitch.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0015800145 15-80-0145 70567-0141
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| Description |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plat 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
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| File Size |
1,218.29K /
7 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
20021444-00008T1LF
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| Description |
Minitek127®, Wire to Board connector, IDC Receptacle, Double Row, 8 Positions, 1.27 mm (.050in) * 1.27 mm (.050in) Pitch.
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0015800147 15-80-0147 A-70567-0209
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| Description |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, Tin (Sn) Plating
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| File Size |
1,218.31K /
7 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
20021221-00008T4LF
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| Description |
Minitek127®, Wire to Board connector, Shrouded vertical header, Surface Mount, Double Row, 8 Positions, 1.27mm (0.500in) Pitch.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0015800381 70567-0017 15-80-0381
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 38 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 38 Circuits, Tin (Sn) Plating
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| File Size |
1,218.40K /
7 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
51701-10000804AALF
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| Description |
PwrBlade®, Power Supply Connectors, 8S 4P STB Vertical Header.
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0015800149 15-80-0149 A-70567-0277
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| Description |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, 0.38渭m (15渭) Gold, (Au) Selective Pla 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating
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| File Size |
1,218.39K /
7 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
20021321-00086D4LF
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| Description |
Minitek127®, Board to Board connectors, PCB mounted Receptacle, Vertical, Surface Mount, Double Row, 86 Positions, 1.27mm (0.05inch) pitch
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0015800165 15-80-0165 70567-0142 A-70567-0142
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| Description |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plat 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating,
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| File Size |
1,218.25K /
7 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
20021221-00008T8LF
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| Description |
Minitek127®, Wire to Board connector, Shrouded vertical header, Surface Mount, Double Row, 8 Positions, 1.27mm (0.500in) Pitch.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0015800169 15-80-0169 A-70567-0278
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| Description |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.38渭m (15渭) Gold, (Au) Selective Pla 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating
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| File Size |
1,218.39K /
7 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
20021311-00088T1LF
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| Description |
1.27mm (0.05in.) pitch, Receptacle Top entry, 88 contacts
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
A-70567-0363 15-80-1501 0015801501
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| Description |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 50 Circuits, 0.76渭m (30渭) Gold, (Au) Selective Pla 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 50 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating
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| File Size |
1,218.39K /
7 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
20021111-00086T4LF
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| Description |
Minitek127®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 86 Positions, 1.27mm (0.050in) pitch.
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| Tech specs |
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Official Product Page
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