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  71851-0224 Datasheet PDF File

For 71851-0224 Found Datasheets File :: 150+       Page :: | 1 | 2 | <3> | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    71764-0224

Molex Electronics Ltd.
Part No. 71764-0224
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 24 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 121.00K  /  5 Page

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Amphenol Communications Solutions

Part No. 87185-127HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 27 Positions, 2.54 mm Pitch, Vertical, 26.49 mm (1.043in) Mating, 2.41 mm (0.095in) Tail.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    A-70400-0224

Molex Electronics Ltd.
Part No. A-70400-0224
Description 2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Female,Single Row, Version C, Front Ribs, Wire Size 26, 3.81μm (150μ) Tin/Lead (SnPb)

File Size 161.14K  /  3 Page

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Amphenol Communications Solutions

Part No. 87185-104HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 4 Positions, 2.54 mm Pitch, Vertical, 26.49 mm (1.043in) Mating, 2.41 mm (0.095in) Tail.
Tech specs    

Official Product Page

    A-42225-0224

Molex Electronics Ltd.
Part No. A-42225-0224
Description 2.54mm (.100) Pitch KK? Header, Breakaway, Vertical, with Polarizing Wall, 14 Circuits, Tin (Sn) Plating, with Backwalls Removed

File Size 190.48K  /  8 Page

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Amphenol Communications Solutions

Part No. 87185-116HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 16 Positions, 2.54 mm Pitch, Vertical, 26.49 mm (1.043in) Mating, 2.41 mm (0.095in) Tail.
Tech specs    

Official Product Page

    73780-0224

Molex Electronics Ltd.
Part No. 73780-0224
Description 2.00mm (.079) Pitch HDM Board-to-Board Daughtercard Receptacle, Vertical, Signal Module, 72 Circuits, Mounted

File Size 202.00K  /  3 Page

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Amphenol Communications Solutions

Part No. 87185-133HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 33 Positions, 2.54 mm Pitch, Vertical, 26.49 mm (1.043in) Mating, 2.41 mm (0.095in) Tail.
Tech specs    

Official Product Page

    35978-0224

Molex Electronics Ltd.
Part No. 35978-0224
Description 3.96mm (.156) Pitch Wire-to-Board Header, Right Angle, Low Profile, 2 Circuits

File Size 107.01K  /  3 Page

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Amphenol Communications Solutions

Part No. 87185-134HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 34 Positions, 2.54 mm Pitch, Vertical, 26.49 mm (1.043in) Mating, 2.41 mm (0.095in) Tail.
Tech specs    

Official Product Page

    102241-9

Tyco Electronics
Part No. 102241-9
Description .100 Inch Centerline AMPMODU Headers, Connectors & Contacts; 11 MODIV HSG COMP SR .100 POL ( AMP )

File Size 38.47K  /  1 Page

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Amphenol Communications Solutions

Part No. 87185-120HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 20 Positions, 2.54 mm Pitch, Vertical, 26.49 mm (1.043in) Mating, 2.41 mm (0.095in) Tail.
Tech specs    

Official Product Page

    List of Unclassifed Man...
Part No. JY0224
Description    Flexible OFC Transparent Audio Cable

File Size 74.66K  /  1 Page

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Amphenol Communications Solutions

Part No. 87185-102HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 2 Positions, 2.54 mm Pitch, Vertical, 26.49 mm (1.043in) Mating, 2.41 mm (0.095in) Tail.
Tech specs    

Official Product Page

    2-102241-0 1-102241-2 1-102241-7 1-102241-4 1-102241-5 1-102241-8 1-102241-0 1-102241-1 1-102241-3 1-102241-6

Tyco Electronics
Part No. 2-102241-0 1-102241-2 1-102241-7 1-102241-4 1-102241-5 1-102241-8 1-102241-0 1-102241-1 1-102241-3 1-102241-6
Description CONN HOUSING, CRIMP SNAP-IN MOD IV, SINGLE ROW,.100 CENTERS, WITH POLARIZATION AND DETENTS

File Size 95.33K  /  1 Page

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Amphenol Communications Solutions

Part No. 87185-113HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 13 Positions, 2.54 mm Pitch, Vertical, 26.49 mm (1.043in) Mating, 2.41 mm (0.095in) Tail.
Tech specs    

Official Product Page

    102241-4

Tyco Electronics
Part No. 102241-4
Description .100 Inch Centerline AMPMODU Headers, Connectors & Contacts; 06 MODIV HSG COMP SR .100 POL ( AMP )

File Size 105.73K  /  1 Page

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Amphenol Communications Solutions

Part No. 87185-111HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 11 Positions, 2.54 mm Pitch, Vertical, 26.49 mm (1.043in) Mating, 2.41 mm (0.095in) Tail.
Tech specs    

Official Product Page

   
Part No. ON0224
Description From old datasheet system

File Size 58.24K  /  4 Page

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Amphenol Communications Solutions

Part No. 87185-118HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 18 Positions, 2.54 mm Pitch, Vertical, 26.49 mm (1.043in) Mating, 2.41 mm (0.095in) Tail.
Tech specs    

Official Product Page

For 71851-0224 Found Datasheets File :: 150+       Page :: | 1 | 2 | <3> | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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