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  87758-1616 Datasheet PDF File

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    87758-1617

Molex Electronics Ltd.
Part No. 87758-1617
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 16 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free

File Size 170.76K  /  4 Page

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Renesas Electronics Corporation

Part No. R1LV1616HBG-4SI#B0
Description Wide Temperature Range Version 16 M SRAM (1-Mword × 16-bit)
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    87758-1650

Molex Electronics Ltd.
Part No. 87758-1650
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 16 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray Packaging, Lead-free

File Size 135.76K  /  4 Page

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Renesas Electronics Corporation

Part No. R1LV1616RSD-7SI#S0
Description Low Power SRAM, TSOP(2), /Embossed Tape
Tech specs    

Official Product Page

    87758-1816

Molex Electronics Ltd.
Part No. 87758-1816
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 18 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free

File Size 170.71K  /  4 Page

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Renesas Electronics Corporation

Part No. R1LV1616RSA-7SR#S0
Description Low Power SRAM, TSOP(1), /Embossed Tape
Tech specs    

Official Product Page

    87758-1817

Molex Electronics Ltd.
Part No. 87758-1817
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 18 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free

File Size 170.70K  /  4 Page

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Renesas Electronics Corporation

Part No. R1LV1616RSD-7SI#B0
Description Low Power SRAM, TSOP(2), /Tray
Tech specs    

Official Product Page

    87758-2017

Molex Electronics Ltd.
Part No. 87758-2017
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 20 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free

File Size 170.76K  /  4 Page

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Renesas Electronics Corporation

Part No. R1LV1616RSD-5SI#S0
Description Low Power SRAM, TSOP(2), /Embossed Tape
Tech specs    

Official Product Page

    87758-3617

Molex Electronics Ltd.
Part No. 87758-3617
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 36 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free

File Size 170.76K  /  4 Page

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Renesas Electronics Corporation

Part No. R1LV1616HBG-5SI#B0
Description Wide Temperature Range Version 16 M SRAM (1-Mword × 16-bit)
Tech specs    

Official Product Page

    87758-3050

Molex Electronics Ltd.
Part No. 87758-3050
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 30 Circuits

File Size 135.64K  /  4 Page

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Renesas Electronics Corporation

Part No. RMLV1616AGSA-5S2#KA0
Description 16Mb Advanced LPSRAM (1M word × 16bit / 2M word x 8bit)
Tech specs    

Official Product Page

    87758-2216

Molex Electronics Ltd.
Part No. 87758-2216
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 22 Circuits, 0.38um (15u) Gold (Au) Selective Plating

File Size 170.71K  /  4 Page

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Renesas Electronics Corporation

Part No. R1LV1616HSA-5SI#B1
Description Wide Temperature Range Version 16 M SRAM (1-Mword × 16-bit / 2-Mword × 8-bit)
Tech specs    

Official Product Page

    87758-3016

Molex Electronics Ltd.
Part No. 87758-3016
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 30 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free

File Size 170.43K  /  4 Page

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    87758-3017

Molex Electronics Ltd.
Part No. 87758-3017
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 30 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free

File Size 170.47K  /  4 Page

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