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  CEP-1162 Datasheet PDF File

For CEP-1162 Found Datasheets File :: 150+       Page :: | 1 | 2 | <3> | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    CEP-1136

CUI INC,
Part No. CEP-1136
Description piezo audio indicator

File Size 668.26K  /  4 Page

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Toshiba Electronic Devices & Storage Corporation

Part No. 2SA1162
Description PNP Bipolar Transistor / VCEO=-50 V / IC=-0.15 A / hFE=70~400 / VCE(sat)=-0.3 V / AEC-Q101 / SOT-346
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    CEP-1108

CUI INC,
Part No. CEP-1108
Description piezo audio transducer

File Size 1,521.69K  /  5 Page

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Amphenol Communications Solutions

Part No. 79821-162HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 62 Positions, 2.54 mm Pitch, Vertical, 10.92 mm (0.43 in.) Mating, 5.08 mm (0.2 in.) Tail.
Tech specs    

Official Product Page

    CEP-2242

CUI INC,
Part No. CEP-2242
Description piezo audio indicator

File Size 299.86K  /  4 Page

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Amphenol Communications Solutions

Part No. 131-5116-21D
Description Paladin® 112Gb/s Backplane Connector, 5-Pair, 6 Column, Open Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    CEP-1106

CUI INC,
Part No. CEP-1106
Description piezo audio transducer

File Size 395.49K  /  5 Page

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Amphenol Communications Solutions

Part No. 131-4116-21H
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 6 Column, Open Wall, Backplane Module, 2.25mm Wipe, APP.
Tech specs    

Official Product Page

    CEP-1173

CUI INC,
Part No. CEP-1173
Description piezo audio transducer

File Size 881.51K  /  4 Page

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Amphenol Communications Solutions

Part No. 77311-162-36LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 36 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    CEP-1172

CUI INC,
Part No. CEP-1172
Description piezo audio transducer

File Size 638.77K  /  4 Page

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Amphenol Communications Solutions

Part No. 10127721-162GLF
Description Minitek® Pwr 3.0, Dual Row, Vertical Through Hole Header, 16 Position, 3.2mm Kink Tail (Gold Flash) plating, GW Compatible LCP, Black Color,Tray Packing.
Tech specs    

Official Product Page

    CEP-2250

CUI INC,
Part No. CEP-2250
Description piezo audio indicator

File Size 240.41K  /  4 Page

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Amphenol Communications Solutions

Part No. 75168-116-20LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled header, Through Hole, Single Row, 20 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    CEP-2280

CUI INC,
Part No. CEP-2280
Description piezo audio indicator

File Size 265.41K  /  4 Page

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Amphenol Communications Solutions

Part No. 54242-811162350LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 16 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    CEP-1123

etc
List of Unclassifed Manufacturers
Part No. CEP-1123
Description CEP-1123

File Size 53.54K  /  1 Page

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Amphenol Communications Solutions

Part No. 131-3116-21D
Description Paladin® 112Gb/s Backplane Connector, 3-Pair, 6 Column, Open Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    CEP-1160

CUI INC,
Part No. CEP-1160
Description piezo audio transducer

File Size 244.37K  /  4 Page

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Amphenol Communications Solutions

Part No. 131-8116-21D
Description Paladin® 112Gb/s Backplane Connector, 8-Pair, 6 Column, Open Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

For CEP-1162 Found Datasheets File :: 150+       Page :: | 1 | 2 | <3> | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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