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  D5F-2B10 Datasheet PDF File

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    Hammond Manufacturing L...
Part No. 1422B10
Description DATA SUBJECT TO CHANGE WITHOUT NOTLCE
File Size 206.81K  /  1 Page

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Amphenol Communications Solutions
Part No. 95278-102B10
Description BergStik®, Board to Board connector, Unshrouded vertical header, Surface Mount, Double Row, 10 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    EUDYNA[Eudyna Devices Inc]
Part No. FLD5F15CX-A
Description 1,550nm DWDM Direct Modulation DFB Laser
File Size 295.20K  /  6 Page

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Amphenol Communications Solutions
Part No. 95278-802B10LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 10 Positions, 2.54 mm Pitch, 5.84 mm (0.23 in.) Mating
Tech specs 　 　

Official Product Page

    EUDYNA[Eudyna Devices Inc]
Part No. FLD5F15CX-E
Description 1,550nm DWDM Direct Modulation DFB Laser
File Size 293.74K  /  6 Page

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Amphenol Communications Solutions
Part No. 95278-102B10LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 10 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs 　 　

Official Product Page

    EUDYNA[Eudyna Devices Inc]
Part No. FLD5F15CX-J
Description 1,550nm DWDM Direct Modulation DFB Laser
File Size 229.55K  /  6 Page

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Amphenol Communications Solutions
Part No. 95278-502B10LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 10 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs 　 　

Official Product Page

    Fujitsu
Part No. FLD5F10NP-A
Description FIBER OPTIC TRANSMITTER
File Size 199.00K  /  6 Page

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Amphenol Communications Solutions
Part No. 95278-402B10LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 10 Positions, 2.54 mm Pitch, Vertical, Tin plating, 5.84 mm (0.23 in.) Mating
Tech specs 　 　

Official Product Page

    EUDYNA[Eudyna Devices Inc]
Part No. FLD5F20NP-C
Description 1,550nm Modulator Integrated DFB Laser
File Size 294.25K  /  6 Page

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Amphenol Communications Solutions
Part No. 10155502-B103KLF
Description Minitek MicroSpaceXS™ 1.27mm Crimp-to-Wire Connector Platform, wire-to-board, Header Vertical, 3 Position, STG, Top Latch, Tin (preplated); B Coding<br><br>(For product qualification latest status, please submit <a href=\\javascript:;\\ class=\\button product-enquiry\\ style=\\background: none;color: red;\\><span>Product Enquiry</span></a>)
Tech specs 　 　

Official Product Page

    EUDYNA[Eudyna Devices Inc]
Part No. FLD5F20NP
Description 1,550nm Modulator Integrated DFB Laser
File Size 288.44K  /  5 Page

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Amphenol Communications Solutions
Part No. 10155552-B105KLF
Description Minitek MicroSpaceXS™ 1.27mm Crimp-to-Wire Connector Platform, wire-to-board, Header Header Vertical, Tin (preplated)
Tech specs 　 　

Official Product Page

    Sumitomo Electric Industries, Ltd.
Part No. FLD5F10NP-A
Description FIBER OPTIC TRANSMITTER 光纤变送器
File Size 165.85K  /  6 Page

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Amphenol Communications Solutions
Part No. NTHBR22B1001SR
Description NETbridge+ 2x2 Right Angle Unseal B code ,100MΩ resistance insulation,3A,Surface Mount termination.
Tech specs 　 　

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    Fujitsu
Part No. FLD5F10NP-B
Description Optoelectronic
File Size 419.19K  /  6 Page

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Amphenol Communications Solutions
Part No. 10155502-B102KLF
Description Minitek MicroSpaceXS™ 1.27mm Crimp-to-Wire Connector Platform, wire-to-board, Header Vertical, 2 Position, STG, Top Latch, Tin (preplated); B Coding<br><br>(For product qualification latest status, please submit <a href=\\javascript:;\\ class=\\button product-enquiry\\ style=\\background: none;color: red;\\><span>Product Enquiry</span></a>)
Tech specs 　 　

Official Product Page

    Fujitsu
Part No. FLD5F15CA-Q
Description Optoelectronic
File Size 133.48K  /  4 Page

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Amphenol Communications Solutions
Part No. 10155552-B104KLF
Description Minitek MicroSpaceXS™ 1.27mm Crimp-to-Wire Connector Platform, wire-to-board, Header Header Vertical, Tin (preplated)
Tech specs 　 　

Official Product Page

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