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  hardening Datasheet PDF File

For hardening Found Datasheets File :: 273    Search Time::1.031ms    
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    Ironwood Electronics
Part No. SLP-9118B-51-T1
OCR Text ... insertion and reflow (adhesive hardening process) taping lamp is automatically inserted and the chip portion is attached to the back side. when using taping lamp in the process through reflow furnace, follow the initial conditions in the n...
Description T-1 SINGLE COLOR LED, RED, 3.1 mm

File Size 48.14K  /  6 Page

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    Ironwood Electronics
Part No. SLP-3118B-51-T1
OCR Text ... insertion and reflow (adhesive hardening process) taping lamp is automatically inserted and the chip portion is attached to the back side. when using taping lamp in the process through reflow furnace, follow the initial conditions in the n...
Description T-1 SINGLE COLOR LED, YELLOW GREEN, 3.1 mm

File Size 48.07K  /  6 Page

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    CS8128-D

ON Semiconductor
Part No. CS8128-D
OCR Text ...et noise immunity on chip emc hardening protection incorporated externally set current limit externally set overvoltage shutdown package options 8 lead so narrow cs8128 5v linear controller/driver 1 v in 2 3 4 sense delay v out pwr gnd ...
Description 5V Linear Controller/Driver

File Size 64.90K  /  8 Page

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    HX6256

Honeywell Solid State Electronics Center
Part No. HX6256
OCR Text ...ary design, layout, and process hardening techniques. The RICMOSTM IV process is a 5-volt, SOI CMOS technology with a 150 A gate oxide and a minimum drawn feature size of 0.75 m (0.6 m effective gate length--Leff). Additional features inclu...
Description 32K x 8 Static RAM

File Size 777.68K  /  13 Page

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    Kemet
Part No. T545Y337M010ATE035 T545H108M006ATE055 T545W477M006ATE035 T545H158M006ATE035
OCR Text ...lications include hold-up, data hardening or vaulting for enterprise and military ssds, and high end desktop modems. overview the kemet organic capacitor is a tantalum capacitor with a ta anode and ta 2 o 5 dielectric. a conductive orga...
Description High Energy Polymer Tantalum

File Size 1,122.21K  /  17 Page

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    UTR100

Aeroflex Circuit Technology
Part No. UTR100
OCR Text ...ed utmc incorporates radiation-hardening techniques in process design, design rules, array design, power distribution, and li- brary element design. all key radiation-hardening process parameters are controlled and monitored using statis...
Description UTR 0.8u gate array.

File Size 52.98K  /  10 Page

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    AN901

STMicroelectronics
Part No. AN901
OCR Text ...d the system must now apply emc hardening techniques in their design. this note aims to provide guidelines for designers of microcontroller-based applications so that the optimum level of emc performances can be achieved. for general inform...
Description Electromagnetic compatibility

File Size 82.77K  /  14 Page

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    HC6856NQRAC35 HC6856WQRAC35 HC6856YQRAC35 HC6856XSHAC40 HC6856YSHAC40 HC6856WVHCC60 HC6856WVHZC35 HC6856NQFAC60 HC6856NQ

Honeywell Solid State Electronics Center
Honeywell Solid State Elect...
Honeywell Solid State E...
Part No. HC6856NQRAC35 HC6856WQRAC35 HC6856YQRAC35 HC6856XSHAC40 HC6856YSHAC40 HC6856WVHCC60 HC6856WVHZC35 HC6856NQFAC60 HC6856NQFCC35 HC6856NQFCC40 HC6856NQFCC60 HC6856NQFZC60 HC6856NQHCC35 HC6856NQHCC60 HC6856NQRCC35 HC6856NQRCC40 HC6856NSFAC60 HC6856NSFCC35 HC6856NSFCC40 HC6856NSFCC60 HC6856NSHCC35 HC6856NSHCC60 HC6856NVFAC60 HC6856WSFAC60 HC6856WVFAC60 HC6856NVHZC35 HC6856WSHZC35 HC6856XSHZC35 HC6856XVHZC35 HC6856YSHZC35 HC6856YVHZC35 HC6856NQRZC35 HC6856WQRZC35 HC6856YQRZC35 HC6856NQRZC60 HC6856WQRZC60 HC6856YQRZC60 HC6856NSRCC35 HC6856WSRCC35 HC6856XSRCC35 HC6856YSRCC35 HC6856NSRCC40 HC6856WSRCC40 HC6856XSRCC40 HC6856YSRCC40 HC6856NSRCC60 HC6856WSRCC60 HC6856XSRCC60 HC6856YSRCC60 HC6856YSRZC35 HC6856YSRZC60 HC6856XQHAC40 HC6856YQHAC40 HC6856YQHCC35 HC6856WQHCC35 HC6856WSHCC35 HC6856XQHCC35 HC6856XSHCC35 HC6856YSHCC35 HC6856WSRZC35 HC6856XVRZC35 HC6856WSRZC60 HC6856NSRZC35 HC6856WVRZC35 HC6856YVRZC35 HC6856NSRZC60 HC6856NVRZC60 HC6856NVRZC35 HC6856XSRZC35 HC6856YSFAC40 HC6856YSFAC60 HC6856YSFCC35 HC6856YSFCC40 HC6856YSFCC60 HC6856XQFZC60 HC6856YQHCC60 HC6856WQHCC60 HC6856XQHCC60 HC6856YQRCC40 HC6856YQRAC40 HC6856YQRCC60 HC6856YQRCC35 HC6856YQFAC40 HC6856XVFAC40 HC6856NQRCC60 HC6856WQRC
OCR Text ...ary design, layout, and process hardening techniques. The RICMOSTM IV process is a 5-volt, twin-well CMOS technology with a 170 A gate oxide and a minimum drawn feature size of 0.8 m (0.65 m effective gate length--Leff). Additional features...
Description 32K x 8 STATIC RAM
   32K x 8 STATIC RAM

File Size 160.17K  /  12 Page

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    SGS Thomson Microelectronics
Part No. AN901
OCR Text ...d the system must now apply emc hardening techniques in their design. this note aims to provide guidelines for designers of microcontroller-based applications so that the optimum level of emc performances can be achieved. for general inform...
Description MCUS - EMC GUIDE-LINES FOR MICROCONTROLLER - BASED APPLICATIONS

File Size 77.57K  /  14 Page

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    CIP21T182NE CIP21T901NE

ETC
Part No. CIP21T182NE CIP21T901NE
OCR Text ...ain inside the resin during the hardening period or while left under normal storage conditions resulting in the deterioration of the splitter's performance. 2. when a resin's hardening temperature is higher than the splitter's operating tem...
Description Splitter

File Size 387.15K  /  11 Page

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For hardening Found Datasheets File :: 273    Search Time::1.031ms    
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