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  HM15-10150LF Datasheet PDF File

For HM15-10150LF Found Datasheets File :: 79+       Page :: | 1 | 2 | <3> | 4 | 5 | 6 | 7 | 8 |   

    SMF-HM1530ID-509

LUMEX INC.
Part No. SMF-HM1530ID-509
Description Surface Mount Socket Fault Indicator

File Size 56.01K  /  1 Page

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Amphenol Communications Solutions

Part No. 98451-101-50LF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Stacking Header, Surface Mount, Double Row, 50 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    HHM1523C1-15

TDK Electronics
Part No. HHM1523C1-15
Description Multilayer Balun

File Size 66.96K  /  6 Page

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Amphenol Communications Solutions

Part No. 93690-101-50LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Press Fit, Double Row, 50 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    HHM1518A3

TDK Electronics
Part No. HHM1518A3
Description Multilayer Chip Baluns For DCS-PCS/Tx & Rx

File Size 38.71K  /  2 Page

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Amphenol Communications Solutions

Part No. 98401-101-50LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Surface Mount, Double Row, 50 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    HHM1523B3

TDK Electronics
Part No. HHM1523B3
Description Multilayer Chip Baluns For AGSM/Tx & Rx

File Size 38.68K  /  2 Page

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Amphenol Communications Solutions

Part No. 55510-150LF
Description <span style=\\background-color: #FFFF00\\><b>PREFERRED P/N SERIES FOR NEW PROJECT: 10131937</b></span><br><br>Minitek® 2.00mm, Board to Board Connector, PCB Mounted Receptacle , Vertical , Surface Mount, Double row, 50 Positions, 2.00mm (0.079in) Pitch.
Tech specs    

Official Product Page

    HHM1522A7

TDK Electronics
Part No. HHM1522A7
Description Multilayer Chip Baluns For AGSM/Tx & Rx
   Multilayer Chip Baluns For AGSM/Tx & Rx

File Size 38.53K  /  2 Page

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Amphenol Communications Solutions

Part No. 10076801-101-50LF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double row , 50 Positions, 2.54mm (0.100in) Pitch, Pin In Paste
Tech specs    

Official Product Page

    HHM1583B1

TDK Electronics
Part No. HHM1583B1
Description Multilayer Chip Baluns For UWB

File Size 42.26K  /  2 Page

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Amphenol Communications Solutions

Part No. 95278-101-50LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 50 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs    

Official Product Page

    HHM1518A3-15

TDK Electronics
Part No. HHM1518A3-15
Description Multilayer Balun

File Size 67.70K  /  6 Page

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Amphenol Communications Solutions

Part No. 67996-240-110150LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 40 Positions, 2.54 mm (0.100in) Pitch
Tech specs    

Official Product Page

   
Part No. HHM1564A4
Description 824 MHz - 894 MHz RF TRANSFORMER ROHS COMPLIANT

File Size 31.80K  /  2 Page

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Amphenol Communications Solutions

Part No. 59112-T40-10-150LF
Description Minitek® 2.00mm, Board To Board, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 20 Positions.
Tech specs    

Official Product Page

    HHM1522B1-15

TDK Electronics
Part No. HHM1522B1-15
Description Multilayer Balun

File Size 67.97K  /  6 Page

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Amphenol Communications Solutions

Part No. 59112-S40-10-150LF
Description Minitek® 2.00mm, Board To Board, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 20 Positions.
Tech specs    

Official Product Page

    HHM1515B2-15

TDK Electronics
Part No. HHM1515B2-15
Description Multilayer Balun

File Size 67.16K  /  6 Page

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Amphenol Communications Solutions

Part No. 77317-101-50LF
Description BergStik®, Board to Board connector, Unshrouded Right angle Header, Through Hole, Double Row, 50 Positions ,2.54mm (0.100in) Pitch,
Tech specs    

Official Product Page

For HM15-10150LF Found Datasheets File :: 79+       Page :: | 1 | 2 | <3> | 4 | 5 | 6 | 7 | 8 |   

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