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HolyStone International
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| Part No. |
HMC
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| Description |
Multilayer Ceramic Chip Capacitors for High Temperature Applications
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| File Size |
243.57K /
3 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
G886C013BTEU
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| Description |
G886 SERIES, Socket 1.5mm Pitch, CRIPMING TYPE, TERMINAL, MATTE TIN
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10155504-C013LF
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| Description |
Minitek MicroSpaceXS™ 1.27mm Crimp-to-Wire Connector Platform, wire-to-board, Receptacle, 13 Position, STG, Top Latch; C Coding<br><br>(For product qualification latest status, please submit <a href=\\javascript:;\\ class=\\button product-enquiry\\ style=\\background: none;color: red;\\><span>Product Enquiry</span></a>)
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10155516-C013LF
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| Description |
Minitek MicroSpaceXS™ 1.27mm, Right Angle, Receptacle, Surface mount, 13 position
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| Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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