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Amphenol Communications Solutions |
Part No. |
54111-408091850LF
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Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded vertical stacked header, Through Hole, Single Row, 9 Positions, 2.54mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
54112-809261850LF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 26 Positions, 2.54mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
78283-850LF
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Description |
Quickie® IDC Cable-to-Board Connector System, Wire To Board connector, Quickie Slimline Header, Through Hole, Vertical, Double Row, 4 Wall , Keyed, 50 Positions, 2.54mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
54112-109501850LF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 50 Positions, 2.54mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
54112-805220850LF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 22 Positions, 2.54mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
54121-806100850LF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 10 Positions, 2.54mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
54121-105360850LF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 36 Positions, 2.54mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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NXP Semiconductors N.V.
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Part No. |
SC16C850L SC16C850LIBS SC16C850LIET157 SC16C850LIBS157 SC16C850LIBS151 SC16C850LIET115
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Description |
1.8 V single UART, 5 Mbit/s (max.) with 128-byte FIFOs, infrared (IrDA) and 16 mode or 68 mode parallel bus interface; Package: SOT912-1 (TFBGA36); Container: Reel Pack, SMD, 7" 1 CHANNEL(S), 5M bps, SERIAL COMM CONTROLLER, PBGA36 1.8 V single UART, 5 Mbit/s (max.) with 128-byte FIFOs, infrared (IrDA) and 16 mode or 68 mode parallel bus interface; Package: SOT617-1 (HVQFN32); Container: Tray Pack, Bakeable, Single 1 CHANNEL(S), 5M bps, SERIAL COMM CONTROLLER, PQCC32 1.8 V single UART, 5 Mbit/s (max.) with 128-byte FIFOs, infrared (IrDA) and 16 mode or 68 mode parallel bus interface; Package: SOT617-1 (HVQFN32); Container: Tray Pack, Bakeable, Multiple 1 CHANNEL(S), 5M bps, SERIAL COMM CONTROLLER, PQCC32 1.8 V single UART, 5 Mbit/s (max.) with 128-byte FIFOs, infrared (IrDA) and 16 mode or 68 mode parallel bus interface; Package: SOT912-1 (TFBGA36); Container: Tray Pack, Bakeable, Multiple 1 CHANNEL(S), 5M bps, SERIAL COMM CONTROLLER, PBGA36
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File Size |
239.44K /
54 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
54112-806360850LF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 36 Positions, 2.54mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
54121-107060850LF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 6 Positions, 2.54mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
54112-112401850LF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 40 Positions, 2.54mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Price and Availability
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