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TSM1N45 1024S15 2SC81 LX1734 2SA0794R EUY23D 16212 54LS1
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  package outline 12bumps 34arra Datasheet PDF File

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    Fairchild Semiconductor, Corp.
Fairchild Semiconductor Corporation
Part No. MSA20
Description 20-Lead Shrink Small outline package (SSOP), EIAJ TYPE II, 5.3mm Wide package Number MSA20 20 -铅收缩小型封装（SSOP封装），EIAJ型二.3mm宽包MSA20
File Size 12.07K  /  1 Page

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    Global Mixed-mode Techn...
Part No. TQFN4X4-24
Description package outline
File Size 115.21K  /  1 Page

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    Global Mixed-mode Techn...
Part No. SOP-7
Description package outline
File Size 206.04K  /  1 Page

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    Infineon
Part No. PG-LQFP-64-12 PG-LQFP-64-19 PG-LQFP-64-22 PG-LQFP-64-6 PG-LQFP-64-8
Description package outline
File Size 112.47K  /  2 Page

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    Infineon
Part No. PG-LQFP-64-13 PG-LQFP-64-5 PG-LQFP-64-4
Description package outline
File Size 476.51K  /  2 Page

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    Global Mixed-mode Techn...
Part No. TQFN4X4-16
Description package outline
File Size 117.91K  /  1 Page

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    Global Mixed-mode Techn...
Part No. TQFN5X5-32
Description package outline
File Size 179.09K  /  1 Page

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    Global Mixed-mode Techn...
Part No. TQFN5X5-40
Description package outline
File Size 180.92K  /  1 Page

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    Global Mixed-mode Techn...
Part No. DFN2X2-10
Description package outline
File Size 186.01K  /  1 Page

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    Global Mixed-mode Techn...
Part No. DFN1.6X1.6-6
Description package outline
File Size 180.78K  /  1 Page

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