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  sot536-1 Datasheet PDF File

For sot536-1 Found Datasheets File :: 36    Search Time::1.484ms    
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    SSTUG32866EC_G SSTUG32866EC_S SSTUG32866 SSTUG32866EC/G SSTUG32866EC/S

NXP Semiconductors
Part No. SSTUG32866EC_G SSTUG32866EC_S SSTUG32866 SSTUG32866EC/G SSTUG32866EC/S
OCR Text ...-pitch ball grid array package; sot536-1 ball compound) 96 balls; body 13.5 x 5.5 x 1.05 mm SSTUG32866EC/S Pb-free (SnAgCu solder LFBGA96 plastic low profile fine-pitch ball grid array package; sot536-1 ball compound) 96 balls; body 13.5 x ...
Description 1.8 V 25-bit 1 : 1 or 14-bit 1 : 2 configurable registered buffer

File Size 142.48K  /  28 Page

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    SSTUH32866EC_G SSTUH32866 SSTUH32866EC SSTUH32866EC/G SSTUH32866EC/G-T SSTUH32866EC/G518 SSTUH32866EC/G557

Philips
NXP Semiconductors N.V.
Part No. SSTUH32866EC_G SSTUH32866 SSTUH32866EC SSTUH32866EC/G SSTUH32866EC/G-T SSTUH32866EC/G518 SSTUH32866EC/G557
OCR Text ...-pitch ball grid array package; sot536-1 96 balls; body 13.5 x 5.5 x 1.05 mm plastic low profile fine-pitch ball grid array package; sot536-1 96 balls; body 13.5 x 5.5 x 1.05 mm 9397 750 14199 (c) Koninklijke Philips Electronics N.V. ...
Description 1.8 V high output drive 25-bit 1 : 1 or 14-bit 1 : 2 configurable registered buffer with parity for DDR2 RDIMM applications

File Size 138.15K  /  28 Page

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    SSTUM32866EC_G SSTUM32866EC_S SSTUM32866 SSTUM32866EC/G SSTUM32866EC/S

NXP Semiconductors
Part No. SSTUM32866EC_G SSTUM32866EC_S SSTUM32866 SSTUM32866EC/G SSTUM32866EC/S
OCR Text ...-pitch ball grid array package; sot536-1 ball compound) 96 balls; body 13.5 x 5.5 x 1.05 mm SSTUM32866EC/S Pb-free (SnAgCu solder LFBGA96 plastic low profile fine-pitch ball grid array package; sot536-1 ball compound) 96 balls; body 13.5 x ...
Description 1.8 V 25-bit 1 : 1 or 14-bit 1 : 2 configurable registered buffer with parity for DDR2-1G RDIMM applications

File Size 142.54K  /  28 Page

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    SSTUB32864 SSTUB32864EC_G SSTUB32864EC/G SSTUB32864EC/G518 SSTUB32864EC/G-T

NXP Semiconductors N.V.
Part No. SSTUB32864 SSTUB32864EC_G SSTUB32864EC/G SSTUB32864EC/G518 SSTUB32864EC/G-T
OCR Text ...dy 13.5 x 5.5 x 1.05 mm Version sot536-1 SSTUB32864_2 (c) NXP B.V. 2007. All rights reserved. Product data sheet Rev. 02 -- 26 March 2007 2 of 19 NXP Semiconductors SSTUB32864 1.8 V configurable registered buffer for D...
Description 1.8 V configurable registered buffer for DDR2-800 RDIMM applications

File Size 105.05K  /  19 Page

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    74LVC32245A 74LVC32245AEC

NXP Semiconductors
Part No. 74LVC32245A 74LVC32245AEC
OCR Text ... C to +85 C Description Version sot536-1 LFBGA96 plastic low profile fine-pitch ball grid array package; 96 balls; body 13.5 x 5.5 x 1.05 mm Type number NXP Semiconductors 74LVC32245A 32-bit bus transceiver with direction pin; 5 V to...
Description 32-bit bus transceiver with direction pin; 5 V tolerant; 3-state
   32-bit bus transceiver with direction pin; 5 V tolerant; 3-state

File Size 80.40K  /  12 Page

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    SSTV16859DGG SSTV16859BS SSTV16859EC

NXP Semiconductors
Part No. SSTV16859DGG SSTV16859BS SSTV16859EC
OCR Text ...STV16859BS DWG NUMBER SOT646AA1 sot536-1 SOT684-1 2002 Feb 19 2 853-2233 27756 Philips Semiconductors Product data 2.5 V 13-bit to 26-bit SSTL_2 registered buffer for stacked DDR DIMM SSTV16859 PIN CONFIGURATION ...
Description 2.5 V 13-bit to 26-bit SSTL_2 registered buffer for stacked DDR DIMM

File Size 114.25K  /  14 Page

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    SSTVF16859DGG SSTVF16859BS SSTVF16859EC SSTVF1685905

NXP Semiconductors
Part No. SSTVF16859DGG SSTVF16859BS SSTVF16859EC SSTVF1685905
OCR Text ...; body 8 x 8 x 0.85 mm SOT646-1 sot536-1 SSTVF16859DGG TSSOP64 plastic thin shrink small outline package; 64 leads; body width 6.1 mm SSTVF16859EC LFBGA96 plastic low profile fine-pitch ball grid array package; 96 balls; body 13.5 x 5.5 ...
Description 13-bit 1 : 2 SSTL_2 registered buffer for DDR

File Size 124.99K  /  23 Page

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    74LVCH32245A 74LVCH32245AEC

NXP Semiconductors
Part No. 74LVCH32245A 74LVCH32245AEC
OCR Text ... C to +85 C Description Version sot536-1 LFBGA96 plastic low profile fine-pitch ball grid array package; 96 balls; body 13.5 x 5.5 x 1.05 mm Type number 74LVCH32245A_3 (c) NXP B.V. 2007. All rights reserved. Product data sheet R...
Description 32-bit bus transceiver with direction pin; 5 V tolerant; 3-state

File Size 83.12K  /  13 Page

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    74LVCH322245A 74LVCH322245AEC

NXP Semiconductors N.V.
Part No. 74LVCH322245A 74LVCH322245AEC
OCR Text ...dy 13.5 x 5.5 x 1.05 mm Version sot536-1 Type number 74LVCH322245A_3 (c) NXP B.V. 2007. All rights reserved. Product data sheet Rev. 03 -- 20 August 2007 2 of 13 NXP Semiconductors 74LVCH322245A 32-bit bus transceiver ...
Description 32-bit bus transceiver with direction pin; 30 Ohm series termination resistors; 5 V tolerant; 3-state
32-bit bus transceiver with direction pin; 30 W series

File Size 83.42K  /  13 Page

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    74LVTH32245EC 74LVTH32245

NXP Semiconductors
Part No. 74LVTH32245EC 74LVTH32245
OCR Text ... C to +85 C Description Version sot536-1 LFBGA96 plastic low profile fine-pitch ball grid array package; 96 balls; body 13.5 x 5.5 x 1.05 mm Type number NXP Semiconductors 74LVTH32245 3.3 V 32-bit bus transceiver; 3-state 4. Funct...
Description 3.3 V 32-bit bus transceiver; 3-state

File Size 82.53K  /  13 Page

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For sot536-1 Found Datasheets File :: 36    Search Time::1.484ms    
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