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SGS Thomson Microelectronics
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| Part No. |
AN261
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| OCR Text |
...lements). A similar methodology was followed with the new H029 pattern, based on two D-Mos transistors (3) havinga total size of 17.000sq mils and a DC power capability of 300 W on an infinite heat sink at room temperature (limited by therm... |
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DESIGNING WITH THERMAL IMPEDANCE
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| File Size |
185.95K /
15 Page |
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Fujitsu Microelectronics
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| Part No. |
1394
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| OCR Text |
...lled a subaction. If the packet was received correctly, then the process continues and the next packet is sent. If an error occurred during transmission or an acknowledgment was not received, then the packet is retransmitted or an error pro... |
| Description |
IEEE 1394 SERIAL BUS CONTROLLER
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| File Size |
87.65K /
30 Page |
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it Online |
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BEHRINGER
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| Part No. |
PMP3000 PMP5000
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| OCR Text |
...to accomplish this goal. But it was fun, too. Developing a product usually brings a lot of people together, and what a great feeling it is when everybody who participated in such a project can be proud of what we've achieved. It is our phil... |
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(PMP1000 - PMP5000) EUROPOWER User Manual
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| File Size |
4,048.79K /
17 Page |
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Electronic Theatre Controls, Inc.
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| Part No. |
HY-5610
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...e, if the thermal time constant was observed to be 5 seconds, then a 1uF capacitor and a 4.7M could be chosen as the loop stabilizing components. Typical values for loop compensation components are shown in Table 1. Note: The values of RG, ... |
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SUBMINIATURE CONTROLLER FOR THERMOELECTRIC COOLERS
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| File Size |
76.29K /
4 Page |
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SGS Thomson Microelectronics
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| Part No. |
AN1471
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| OCR Text |
...
The interrupted transmission was an Incoming Data Byte The interrupted transmission was an Outgoing Data Byte (during a READ cycle)
The interrupted transmission was an Incoming Data Byte The issue of a STOP condition is sufficient to ... |
| Description |
WHAT HAPPENS TO THE M24XXX I2C EEPROM IF THE I2C BUS COMMUNICATION IS STOPPED?
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| File Size |
27.63K /
4 Page |
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SGS Thomson Microelectronics
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| Part No. |
AN1227
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...a Finite-Element Analysis (FEA) was performed to solve the steady-state temperature distribution under a given device power dissipation using an evaluation copy of ANSYS/Multiphysics software. Since the die is rectangular, two axes of symme... |
| Description |
IMPROVED RF MOSFET RELIABILITY THROUGH PACKAGING ENHANCEMENTS
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| File Size |
50.24K /
4 Page |
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it Online |
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