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  030-7584.0 Datasheet PDF File

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    0877584616 87758-4616

Molex Electronics Ltd.
Part No. 0877584616 87758-4616
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 46 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 46 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free

File Size 170.71K  /  4 Page

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Amphenol Communications Solutions

Part No. 75844-107-72LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 72 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    HUF75842P3

Intersil Corporation
Part No. HUF75842P3
Description 43A, 150V, 0.042 Ohm, N-Channel,UltraFET Power MOSFET(43A, 150V, 0.042Ω N沟道2.5V专用功率MOS场效应管)

File Size 122.25K  /  9 Page

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Amphenol Communications Solutions

Part No. 75844-342-10LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 10 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0877584617 87758-4617

Molex Electronics Ltd.
Part No. 0877584617 87758-4617
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 46 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 46 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free

File Size 170.70K  /  4 Page

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Amphenol Communications Solutions

Part No. 75844-122-72LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 72 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0877584650 87758-4650

Molex Electronics Ltd.
Part No. 0877584650 87758-4650
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 46 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray Packaging, Lead-free

File Size 135.77K  /  4 Page

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Amphenol Communications Solutions

Part No. 75844-340-10LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 10 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    OKI[OKI electronic componets]
Part No. MSM7584CTS-K MSM7584C
Description pi /4 Shift QPSK MODEM/ADPCM CODEC

File Size 300.57K  /  57 Page

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Amphenol Communications Solutions

Part No. 75844-302-06LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 6 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    OKI[OKI electronic componets]
Part No. MSM7584DTS-K MSM7584D
Description pi/4 Shift QPSK MODEM/ADPCM CODEC

File Size 389.58K  /  58 Page

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Amphenol Communications Solutions

Part No. 75844-112-56LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 56 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0877584417

Molex Electronics Ltd.
Part No. 0877584417
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 44 Circuits, 0.76um (30u) Gold (Au) Selective Plating

File Size 170.76K  /  4 Page

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Amphenol Communications Solutions

Part No. 75844-194-20LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 20 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0877584416

Molex Electronics Ltd.
Part No. 0877584416
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 44 Circuits

File Size 170.71K  /  4 Page

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Amphenol Communications Solutions

Part No. 75844-127-18LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 18 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0877584850 87758-4850

Molex Electronics Ltd.
Part No. 0877584850 87758-4850
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 48 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray Packaging, Lead-free

File Size 135.77K  /  4 Page

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Amphenol Communications Solutions

Part No. 75844-118-10LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 10 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0877584816 87758-4816

Molex Electronics Ltd.
Part No. 0877584816 87758-4816
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 48 Circuits, 0.38μm(15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 48 Circuits, 0.38μm(15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free

File Size 170.71K  /  4 Page

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Amphenol Communications Solutions

Part No. 75844-156-14LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 14 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

For 030-7584.0 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | <4> | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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