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  43650-0810 Datasheet PDF File

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    43650-0812

Molex Electronics Ltd.
Part No. 43650-0812
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Single Row, Right Angle, with Solder Tab, 8 Circuits, Tin (Sn) Plating, Glow Wire Compatible
File Size 153.06K  /  3 Page

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Rochester Electronics LLC
Part No. MC28F008-10/B
Description 28F008 - Flash, 1MX8, 100ns, CDIP40
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    43650-1126

Molex Electronics Ltd.
Part No. 43650-1126
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Single Row,Vertical, with Solder Tab, 11 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Glow Wire Compatible
File Size 170.66K  /  3 Page

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Rochester Electronics LLC
Part No. MC28F008-10
Description 28F008 - Flash, 1MX8, 100ns, CDIP40
Tech specs 　 　

Official Product Page

    43650-0817

Molex Electronics Ltd.
Part No. 43650-0817
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Single Row, Vertical, with PCB Polarizing Peg
File Size 153.96K  /  3 Page

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Rochester Electronics LLC
Part No. MF28F008-10
Description 28F008 - Flash, 1MX8, 100ns, CDFP42
Tech specs 　 　

Official Product Page

    43650-0811

Molex Electronics Ltd.
Part No. 43650-0811
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Single Row,Right Angle, with PCB Press-fit Metal Retention Clip, 8 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
File Size 163.60K  /  3 Page

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Amphenol Communications Solutions
Part No. 75168-308-10LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled header, Through Hole, Single Row, 10 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    43650-0815

Molex Electronics Ltd.
Part No. 43650-0815
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Single Row, Vertical, with PCB Polarizing Peg, 8 Circuits, Tin (Sn) Plating, Glow Wire Compatible
File Size 153.89K  /  3 Page

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Amphenol Communications Solutions
Part No. 54112-108101200LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 10 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    43650-0820

Molex Electronics Ltd.
Part No. 43650-0820
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Single Row, Vertical
File Size 169.25K  /  3 Page

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Amphenol Communications Solutions
Part No. 54112-806081050LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 8 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    43650-0821

Molex Electronics Ltd.
Part No. 43650-0821
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Single Row, Vertical, with Press-fit
File Size 164.47K  /  3 Page

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Amphenol Communications Solutions
Part No. 78208-108HLF
Description PV Shrouded Header, Wire to Board connector, 2 Wall Shrouded Header - Through Hole - Single row - 8 Positions 2.54mm - Right Angle.
Tech specs 　 　

Official Product Page

    43650-1123

Molex Electronics Ltd.
Part No. 43650-1123
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Single Row,Vertical, with Press-fit Metal Retention Clip, 11 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
File Size 163.93K  /  3 Page

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Amphenol Communications Solutions
Part No. 76308-107LF
Description Dubox® 2.54mm, Board to Board Connector, 7 Positions,Single Row,Vertical,2.54mm pitch,Card Connector.
Tech specs 　 　

Official Product Page

    43650-0925

Molex Electronics Ltd.
Part No. 43650-0925
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Single Row, Vertical, with Solder Tab, 9
File Size 170.66K  /  3 Page

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Amphenol Communications Solutions
Part No. 54202-F0810PLF
Description CONNECTOR, BERGSTIK 0.10-SMT,D/R,PICK-UP CAPS
Tech specs 　 　

Official Product Page

    43650-1124

Molex Electronics Ltd.
Part No. 43650-1124
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Single Row,Vertical, with Solder Tab, 11 Circuits, Tin (Sn) Plating, Glow Wire Compatible
File Size 170.59K  /  3 Page

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Amphenol Communications Solutions
Part No. 54112-808101500LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 10 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

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