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  5SD-9441 Datasheet PDF File

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    Bourns, Inc.
Part No. SC15A-5SDAC-Z
Description Power Module
Switch-Power Non-Isolated DC-DC Converters 5V to 1.3-3.5V 15A 1-OUTPUT DC-DC REG PWR SUPPLY MODULE

File Size 221.82K  /  2 Page

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Amphenol Communications Solutions

Part No. 93944-119HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Single Row, 19 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    BOURNS[Bourns Electronic Solutions]
Part No. SC15A-5SDAC-Z SC15A
Description Power Module

File Size 190.31K  /  2 Page

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Amphenol Communications Solutions

Part No. 93944-134HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Single Row, 34 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    SC10A SC10A-5SDAC-Z

BOURNS[Bourns Electronic Solutions]
Part No. SC10A SC10A-5SDAC-Z
Description Power Module

File Size 187.11K  /  2 Page

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Amphenol Communications Solutions

Part No. 93944-127HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Single Row, 27 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0739441017

Molex Electronics Ltd.
Part No. 0739441017
Description 2.00mm (.079") Pitch HDM Board-to-Board Backplane Header, Vertical, SMC, Solder Tail, Guide Pin Option, 144 Circuits

File Size 154.07K  /  4 Page

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Amphenol Communications Solutions

Part No. 93944-114HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Single Row, 14 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87759-4414 0877594414

Molex Electronics Ltd.
Part No. 87759-4414 0877594414
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 44 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Lead-free
2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 44 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Lead-free

File Size 420.16K  /  8 Page

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Amphenol Communications Solutions

Part No. 93944-108HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Single Row, 8 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0739441005

Molex Electronics Ltd.
Part No. 0739441005
Description 2.00mm (.079) Pitch HDM Board-to-Board Backplane Header, Vertical, SMC, Solder Tail, Guide Pin Option

File Size 153.82K  /  4 Page

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Amphenol Communications Solutions

Part No. 93944-132HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Single Row, 32 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0739441009

Molex Electronics Ltd.
Part No. 0739441009
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, SolderTail, Guide Pin Option, 144 Circuits

File Size 153.82K  /  4 Page

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Amphenol Communications Solutions

Part No. 93944-125HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Single Row, 25 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0739441217

Molex Electronics Ltd.
Part No. 0739441217
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, SolderTail, Guide Pin Option, 144 Circuits

File Size 154.07K  /  4 Page

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Amphenol Communications Solutions

Part No. 93944-112HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Single Row, 12 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87759-4415 0877594415

Molex Electronics Ltd.
Part No. 87759-4415 0877594415
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 44 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Lead-free
2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 44 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Lead-free

File Size 279.40K  /  6 Page

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Amphenol Communications Solutions

Part No. 93944-104HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Single Row, 4 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0739441016

Molex Electronics Ltd.
Part No. 0739441016
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, SolderTail, Guide Pin Option, 144 Circuits

File Size 154.07K  /  4 Page

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Amphenol Communications Solutions

Part No. 93944-135HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Single Row, 35 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

For 5SD-9441 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | <4> | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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