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  7054 Datasheet PDF File

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    70543-0021

Molex Electronics Ltd.
Part No. 70543-0021
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 22Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

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Amphenol Communications Solutions

Part No. 10136647-054232LF
Description Minitek® Pwr 4.2, Single Row, Vertical Through Hole Header, LCP, 30u\\ Gold (Tin on Tails) plating, Black Color, 5 Positions, GW Compatible, with out Posts, Tray packing.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    70543-0022

Molex Electronics Ltd.
Part No. 70543-0022
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 23Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 418.15K  /  4 Page

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Amphenol Communications Solutions

Part No. 10136647-054132LF
Description Minitek® Pwr 4.2, Single Row, Vertical Through Hole Header, LCP, 30u\\ Gold (Tin on Tails) plating, Natural Color, 5 Positions, GW Compatible, with out Posts, Tray packing.
Tech specs    

Official Product Page

    70543-0024

Molex Electronics Ltd.
Part No. 70543-0024
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 25Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 418.15K  /  4 Page

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Amphenol Communications Solutions

Part No. 68705-430HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 30 Positions, 2.54 mm Pitch, Vertical, 5.08 mm (0.2 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs    

Official Product Page

    70543-0020

Molex Electronics Ltd.
Part No. 70543-0020
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 21Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 418.15K  /  4 Page

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Amphenol Communications Solutions

Part No. 68705-417HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 17 Positions, 2.54 mm Pitch, Vertical, 5.08 mm (0.2 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs    

Official Product Page

    70543-0016

Molex Electronics Ltd.
Part No. 70543-0016
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 17Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 418.18K  /  4 Page

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Amphenol Communications Solutions

Part No. 68705-425HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 25 Positions, 2.54 mm Pitch, Vertical, 5.08 mm (0.2 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs    

Official Product Page

    70543-0023

Molex Electronics Ltd.
Part No. 70543-0023
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 24Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 418.15K  /  4 Page

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Amphenol Communications Solutions

Part No. 68705-420HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 20 Positions, 2.54 mm Pitch, Vertical, 5.08 mm (0.2 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs    

Official Product Page

    70543-0013

Molex Electronics Ltd.
Part No. 70543-0013
Description 2.54mm (.100) Pitch SLHeader, Single Row, Vertical, .120 Pocket, Shrouded, 14 Circuits, 0.38um (15u)

File Size 418.24K  /  4 Page

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Amphenol Communications Solutions

Part No. 68705-412HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 12 Positions, 2.54 mm Pitch, Vertical, 5.08 mm (0.2 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs    

Official Product Page

    70543-0036

Molex Electronics Ltd.
Part No. 70543-0036
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 2Circuits, Tin (Sn) Plating

File Size 418.20K  /  4 Page

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Amphenol Communications Solutions

Part No. 68705-424HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 24 Positions, 2.54 mm Pitch, Vertical, 5.08 mm (0.2 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs    

Official Product Page

    70543-0038

Molex Electronics Ltd.
Part No. 70543-0038
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 4Circuits, Tin (Sn) Plating

File Size 418.20K  /  4 Page

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Amphenol Communications Solutions

Part No. 10136647-054121LF
Description Minitek® Pwr 4.2, Single Row, Vertical Through Hole Header, Nylon 66, 30u\\ Gold (Tin on Tails) plating, Natural Color, 5 Positions, Non GW Compatible, with Posts, Tray packing.
Tech specs    

Official Product Page

    70543-0037

Molex Electronics Ltd.
Part No. 70543-0037
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 3Circuits, Tin (Sn) Plating

File Size 418.23K  /  4 Page

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Amphenol Communications Solutions

Part No. 68705-405HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 5 Positions, 2.54 mm Pitch, Vertical, 5.08 mm (0.2 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs    

Official Product Page

For 7054 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | <4> | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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