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  70567-0008 Datasheet PDF File

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    0015800281 70567-0012 15-80-0281

Molex Electronics Ltd.
Part No. 0015800281 70567-0012 15-80-0281
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, Tin (Sn) Plating
MOLEX Connector

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Amphenol Cables on Demand

Part No. CS-VHDCIMX200-008
Description Amphenol CS-VHDCIMX200-008 VHDCI SCSI (SCSI-5) LVD/SE Cable - .8mm 68-pin VHDCI SCSI Male to Male 8m
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    70567-0011 A-70567-0011 0015800261

Molex Electronics Ltd.
Part No. 70567-0011 A-70567-0011 0015800261
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 26 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 26 Circuits, Tin (Sn) Plating

File Size 1,218.43K  /  7 Page

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Amphenol Communications Solutions

Part No. 20021121-00008T8LF
Description Minitek127®, Board to Board connector, Unshrouded vertical header, Surface Mount, Double Row, 8Positions, 1.27mm (0.5inch) pitch.
Tech specs    

Official Product Page

    70567-0010 A-70567-0010 0015800241

Molex Electronics Ltd.
Part No. 70567-0010 A-70567-0010 0015800241
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 24 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 24 Circuits, Tin (Sn) Plating

File Size 1,218.42K  /  7 Page

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Amphenol Communications Solutions

Part No. 20021121-00086T4LF
Description Minitek127®, Board to Board connector, Unshrouded vertical header, Surface Mount, Double Row, 86Positions, 1.27mm (0.5inch) pitch.
Tech specs    

Official Product Page

    0015800181 70567-0007 A-70567-0007 15-80-0181

Molex Electronics Ltd.
Part No. 0015800181 70567-0007 A-70567-0007 15-80-0181
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 18 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 18 Circuits, Tin (Sn) Plating
MOLEX Connector

File Size 1,218.43K  /  7 Page

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Amphenol Communications Solutions

Part No. 20021444-00008T1LF
Description Minitek127®, Wire to Board connector, IDC Receptacle, Double Row, 8 Positions, 1.27 mm (.050in) * 1.27 mm (.050in) Pitch.
Tech specs    

Official Product Page

    0015800187 15-80-0187 A-70567-0211

Molex Electronics Ltd.
Part No. 0015800187 15-80-0187 A-70567-0211
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, Tin (Sn) Plating
MOLEX Connector

File Size 1,218.53K  /  7 Page

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Amphenol Communications Solutions

Part No. 20021221-00008T4LF
Description Minitek127®, Wire to Board connector, Shrouded vertical header, Surface Mount, Double Row, 8 Positions, 1.27mm (0.500in) Pitch.
Tech specs    

Official Product Page

    15-80-0129 0015800129 A-70567-0276

Molex Electronics Ltd.
Part No. 15-80-0129 0015800129 A-70567-0276
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, 0.38渭m (15渭) Gold, (Au) Selective Pla
Molex Electronics Ltd.

File Size 1,218.57K  /  7 Page

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Amphenol Communications Solutions

Part No. 51701-10000804AALF
Description PwrBlade®, Power Supply Connectors, 8S 4P STB Vertical Header.
Tech specs    

Official Product Page

    0015800289 A-70567-0284

Molex Electronics Ltd.
Part No. 0015800289 A-70567-0284
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating
MOLEX Connector

File Size 1,218.56K  /  7 Page

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Amphenol Communications Solutions

Part No. 20021321-00086D4LF
Description Minitek127®, Board to Board connectors, PCB mounted Receptacle, Vertical, Surface Mount, Double Row, 86 Positions, 1.27mm (0.05inch) pitch
Tech specs    

Official Product Page

    70567-0152 A-70567-0152 15-80-0365 0015800365

Molex Electronics Ltd.
Part No. 70567-0152 A-70567-0152 15-80-0365 0015800365
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 36 Circuits

File Size 1,218.29K  /  7 Page

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Amphenol Communications Solutions

Part No. 20021221-00008T8LF
Description Minitek127®, Wire to Board connector, Shrouded vertical header, Surface Mount, Double Row, 8 Positions, 1.27mm (0.500in) Pitch.
Tech specs    

Official Product Page

    15-80-0125 0015800125 70567-0140

Molex Electronics Ltd.
Part No. 15-80-0125 0015800125 70567-0140
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, 0.76渭m (30渭") Gold (Au) Selective Pla
Molex Electronics Ltd.

File Size 1,218.47K  /  7 Page

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Amphenol Communications Solutions

Part No. 20021311-00088T1LF
Description 1.27mm (0.05in.) pitch, Receptacle Top entry, 88 contacts
Tech specs    

Official Product Page

    15-80-0109 0015800109 70567-0275 A-70567-0275

Molex Electronics Ltd.
Part No. 15-80-0109 0015800109 70567-0275 A-70567-0275
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.38渭m (15渭) Gold, (Au) Selective Pla
Molex Electronics Ltd.

File Size 1,218.56K  /  7 Page

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Amphenol Communications Solutions

Part No. 20021111-00086T4LF
Description Minitek127®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 86 Positions, 1.27mm (0.050in) pitch.
Tech specs    

Official Product Page

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