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  70567-0011 Datasheet PDF File

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    0015800169 15-80-0169 A-70567-0278

Molex Electronics Ltd.
Part No. 0015800169 15-80-0169 A-70567-0278
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.38渭m (15渭) Gold, (Au) Selective Pla
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating

File Size 1,218.39K  /  7 Page

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Amphenol Communications Solutions

Part No. CE1600000110111
Description Cool Edge 0.80mm Hybrid Power and Signal Connectors, Storage and Server System, Through Hole, 6 power pins, Zero signal pin, Vertical
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    70567-0152 A-70567-0152 15-80-0365 0015800365

Molex Electronics Ltd.
Part No. 70567-0152 A-70567-0152 15-80-0365 0015800365
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 36 Circuits

File Size 1,218.29K  /  7 Page

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Amphenol Communications Solutions

Part No. CE1414000110111
Description Cool Edge 0.80mm Hybrid Power and Signal Connectors, Storage and Server System, Through Hole/Surface mount, 4 power pins, 140 signal pins, Vertical
Tech specs    

Official Product Page

    70567-0151 0015800345

Molex Electronics Ltd.
Part No. 70567-0151 0015800345
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 34 Circuits

File Size 1,218.29K  /  7 Page

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Amphenol Communications Solutions

Part No. CE1400000110111
Description Cool Edge 0.80mm Hybrid Power and Signal Connectors, Storage and Server System, Through Hole, 4 power pins, Zero signal pins, Vertical
Tech specs    

Official Product Page

    15-80-0107 0015800107 A-70567-0207

Molex Electronics Ltd.
Part No. 15-80-0107 0015800107 A-70567-0207
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, Tin (Sn) Plating
Molex Electronics Ltd.

File Size 1,218.53K  /  7 Page

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Amphenol Communications Solutions

Part No. CE1210000110111
Description Cool Edge 0.80mm Hybrid Power and Signal Connectors, Storage and Server System, Through Hole/Surface mount, 2 power pins, 100 signal pins, Vertical
Tech specs    

Official Product Page

    15-80-0109 0015800109 70567-0275 A-70567-0275

Molex Electronics Ltd.
Part No. 15-80-0109 0015800109 70567-0275 A-70567-0275
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.38渭m (15渭) Gold, (Au) Selective Pla
Molex Electronics Ltd.

File Size 1,218.56K  /  7 Page

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Amphenol Communications Solutions

Part No. CE1220000110111
Description Cool Edge 0.80mm Hybrid Power and Signal Connectors, Storage and Server System, Through Hole/Surface mount, 2 power pins, 200 signal pins, Vertical
Tech specs    

Official Product Page

    0015800381 70567-0017 15-80-0381

Molex Electronics Ltd.
Part No. 0015800381 70567-0017 15-80-0381
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 38 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 38 Circuits, Tin (Sn) Plating

File Size 1,218.40K  /  7 Page

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Amphenol Communications Solutions

Part No. CE1208000110111
Description Cool Edge 0.80mm Hybrid Power and Signal Connectors, Storage and Server System, Through Hole/Surface mount, 2 power pins, 80 signal pins, Vertical
Tech specs    

Official Product Page

    0015800289 A-70567-0284

Molex Electronics Ltd.
Part No. 0015800289 A-70567-0284
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating
MOLEX Connector

File Size 1,218.56K  /  7 Page

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Amphenol Communications Solutions

Part No. CE1202000110111
Description Cool Edge 0.80mm Hybrid Power and Signal Connectors, Storage and Server System, Through Hole/Surface mount, 2 power pins, 20 signal pins, Vertical
Tech specs    

Official Product Page

    0015800187 15-80-0187 A-70567-0211

Molex Electronics Ltd.
Part No. 0015800187 15-80-0187 A-70567-0211
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, Tin (Sn) Plating
MOLEX Connector

File Size 1,218.53K  /  7 Page

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Amphenol Communications Solutions

Part No. CE1610000110111
Description Cool Edge 0.80mm Hybrid Power and Signal Connectors, Storage and Server System, Through Hole/Surface mount, 6 power pins, 100 signal pins, Vertical
Tech specs    

Official Product Page

    0015800181 70567-0007 A-70567-0007 15-80-0181

Molex Electronics Ltd.
Part No. 0015800181 70567-0007 A-70567-0007 15-80-0181
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 18 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 18 Circuits, Tin (Sn) Plating
MOLEX Connector

File Size 1,218.43K  /  7 Page

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Amphenol Communications Solutions

Part No. CE1604000110111
Description Cool Edge 0.80mm Hybrid Power and Signal Connectors, Storage and Server System, Through Hole/Surface mount, 6 power pins, 40 signal pins, Vertical
Tech specs    

Official Product Page

    0015800281 70567-0012 15-80-0281

Molex Electronics Ltd.
Part No. 0015800281 70567-0012 15-80-0281
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, Tin (Sn) Plating
MOLEX Connector

File Size 1,218.43K  /  7 Page

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Amphenol Communications Solutions

Part No. 68000-119HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 19 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs    

Official Product Page

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