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  71764-0022 Datasheet PDF File

For 71764-0022 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | <4> | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    71764-0016 0717640016

Molex Electronics Ltd.
Part No. 71764-0016 0717640016
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 16 Circuits, Tin (Sn) Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 16 Circuits, Tin (Sn) Plating

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Amphenol Communications Solutions

Part No. 10127820-0222LLF
Description Minitek® Pwr 4.2, Dual Row, Vertical Through Hole Header, 80u\\ Min Tin plating, Natural Color, 2 Positions, LCP, GW Compatible, Tray Packing.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0717640206 71764-0206

Molex Electronics Ltd.
Part No. 0717640206 71764-0206
Description 2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right Angle,High Temperature, 6 Circuits, 0.76渭m (30渭") Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right Angle,High Temperature, 6 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 120.93K  /  5 Page

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Amphenol Communications Solutions

Part No. 10127820-0221GLF
Description Minitek® Pwr 4.2, Dual Row, Vertical Through Hole Header, Gold Flash plating, Natural Color, 2 Positions, GW Compatible Nylon66, Tray Packing.
Tech specs    

Official Product Page

    0717640204 71764-0204

Molex Electronics Ltd.
Part No. 0717640204 71764-0204
Description 2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 4 Circuits, 0.76渭m (30渭") Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 4 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 120.70K  /  5 Page

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Amphenol Communications Solutions

Part No. 68002-214HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 14 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0717640112 71764-0112

Molex Electronics Ltd.
Part No. 0717640112 71764-0112
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 12 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 12 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating
MOLEX Connector

File Size 121.09K  /  5 Page

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Amphenol Communications Solutions

Part No. 20021122-00022T1LF
Description Minitek127® 1.27mm, Board To Board, Unshrouded header, Surface Mount, 22 contacts.
Tech specs    

Official Product Page

    71764-0012 0717640012

Molex Electronics Ltd.
Part No. 71764-0012 0717640012
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 12 Circuits, Tin (Sn) Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 12 Circuits, Tin (Sn) Plating

File Size 121.14K  /  5 Page

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Amphenol Communications Solutions

Part No. 20021311-00022T8LF
Description 1.27mm (0.05in.) pitch, Receptacle Top entry, 22 contacts
Tech specs    

Official Product Page

    71764-0010 0717640010

Molex Electronics Ltd.
Part No. 71764-0010 0717640010
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 10 Circuits, Tin (Sn) Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 10 Circuits, Tin (Sn) Plating

File Size 121.14K  /  5 Page

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Amphenol Communications Solutions

Part No. 68000-228HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 28 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs    

Official Product Page

    0717640214 71764-0214

Molex Electronics Ltd.
Part No. 0717640214 71764-0214
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 14 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
MOLEX Connector

File Size 121.16K  /  5 Page

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Amphenol Communications Solutions

Part No. 20021321-00022D8LF
Description Minitek127®, Board to Board connectors, PCB mounted Receptacle, Vertical, Surface Mount, Double Row, 22 Positions, 1.27mm (0.05inch) pitch
Tech specs    

Official Product Page

    0717640212 71764-0212

Molex Electronics Ltd.
Part No. 0717640212 71764-0212
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 12 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
MOLEX Connector

File Size 121.09K  /  5 Page

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Amphenol Communications Solutions

Part No. 20021321-00022T8LF
Description Minitek127®, Board to Board connectors, PCB mounted Receptacle, Vertical, Surface Mount, Double Row, 22 Positions, 1.27mm (0.05inch) pitch
Tech specs    

Official Product Page

    71764-0230 0717640230

Molex Electronics Ltd.
Part No. 71764-0230 0717640230
Description 2.54mm (.100

File Size 121.05K  /  5 Page

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Amphenol Communications Solutions

Part No. 68002-225HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 25 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0717640208 71764-0208

Molex Electronics Ltd.
Part No. 0717640208 71764-0208
Description 2.54mm (.100") Pitch C-Grid Breakaway Header, Low Profile, Dual Row, Right Angle, High Temperature, 8 Circuits
2.54mm (.100) Pitch C-Grid Breakaway Header, Low Profile, Dual Row, Right Angle, High Temperature, 8 Circuits

File Size 120.93K  /  5 Page

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Amphenol Communications Solutions

Part No. 20021311-00022T4LF
Description 1.27mm (0.05in.) pitch, Receptacle Top entry, 22 contacts
Tech specs    

Official Product Page

For 71764-0022 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | <4> | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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