| |
|
 |
Amphenol Communications Solutions |
| Part No. |
10135175-14110LF
|
| Description |
Minitek® 1.5mm Wire to Board Plug HSG, 14 positions
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
 |
Amphenol Communications Solutions |
| Part No. |
131-7514-21H
|
| Description |
Paladin® 112Gb/s Backplane Connector, 7-Pair, 4 Column, Left Polarized, Backplane Module, 2.25mm Wipe, APP.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
 |
Amphenol Communications Solutions |
| Part No. |
131-7514-11H
|
| Description |
Paladin® 112Gb/s Backplane Connector, 7-Pair, 4 Column, Left Polarized, Backplane Module, 1.5mm Wipe, APP.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
 |
Amphenol Communications Solutions |
| Part No. |
131-7514-11D
|
| Description |
Paladin® 112Gb/s Backplane Connector, 7-Pair, 4 Column, Left Polarized, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
 |
Amphenol Communications Solutions |
| Part No. |
131-7514-21D
|
| Description |
Paladin® 112Gb/s Backplane Connector, 7-Pair, 4 Column, Left Polarized, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
 |
Amphenol Communications Solutions |
| Part No. |
10137514-001LF
|
| Description |
HPCE VT Receptacle 14LP Omitted 4LP
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
 |

Molex Electronics Ltd.
|
| Part No. |
0009075147 A-7675-A14J
|
| Description |
3.96mm (.156") KK庐 IDT Double Cantilever Contact, 14 Circuits, Tin (Sn), Feed- Through, 24 and 22 Solid or Fused Stranded, and 22 Stranded, Black I 3.96mm (.156) KK? IDT Double Cantilever Contact, 14 Circuits, Tin (Sn), Feed- Through, 24 and 22 Solid or Fused Stranded, and 22 Stranded, Black I
|
| File Size |
458.43K /
26 Page |
View
it Online |
Download Datasheet
|
| |
|
 |

Molex Electronics Ltd.
|
| Part No. |
15-47-7514 0015477514 A-70568-0005
|
| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 14 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 14 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 14 Circuits, Tin (Sn) Plating
|
| File Size |
377.43K /
4 Page |
View
it Online |
Download Datasheet
|
|

Bom2Buy.com

Price and Availability
|