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  75757-5121 Datasheet PDF File

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Part No. 75757-5421
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 4 Circuits, 1.5μm (60μ) Tin (Sn) Plating, 16.09mm (.633) Mating Pin Length, 3.05mm (.120) PC Tail Length

File Size 166.19K  /  4 Page

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Rochester Electronics LLC

Part No. AM27C512-120DE
Description AM27C512 - 512K (64K x 8) CMOS EPROM
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    75757-5241

Molex Electronics Ltd.
Part No. 75757-5241
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 8 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail

File Size 166.27K  /  4 Page

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Rochester Electronics LLC

Part No. AM27C512-150DI
Description AM27C512 - 512K (64K x 8) CMOS EPROM
Tech specs    

Official Product Page

    75757-5101

Molex Electronics Ltd.
Part No. 75757-5101
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 20 Circuits, 2.50μm (100μ) Tin (Sn) Plating, 16.09mm (.633) Mating Pin Length

File Size 166.21K  /  4 Page

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Rochester Electronics LLC

Part No. 27C512-150JI
Description 27C512 - 512K (64K x 8) CMOS EPROM
Tech specs    

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    75757-1401 75757-1402 75757-1302 75757-1301 75757-1202 75757-1201

Molex Electronics Ltd.
MOLEX INC
Part No. 75757-1401 75757-1402 75757-1302 75757-1301 75757-1202 75757-1201
Description MX150垄芒 Dual-Row Unshrouded Breakaway Header
MX150?/a> Dual-Row Unshrouded Breakaway Header
MX150 2X10 VERT HEADER ASSY 1.5 TIN

File Size 230.37K  /  2 Page

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Rochester Electronics LLC

Part No. AM27C512-120DC
Description AM27C512 - 512K (64K x 8) CMOS EPROM
Tech specs    

Official Product Page

   
Part No. CS-5121
Description
File Size 488.36K  /  7 Page

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Rochester Electronics LLC

Part No. AM27C512-120PI-G
Description AM27C512 - 512Kb (64K x 8-Bit) CMOS OTP EPROM
Tech specs    

Official Product Page

    IDT-5121

Advantech Co., Ltd.
Part No. IDT-5121
Description    Industrial Disk Tray/Bay

File Size 1,222.76K  /  3 Page

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Amphenol Communications Solutions

Part No. 10137925-1211LF
Description Minitek® Pwr 3.0, Dual Row, Right Angle SMT Tails and DIP Hold Down Header, Tin plating, Black Color, 12 Positions, GW Compatible LCP, Tape and Reel. .
Tech specs    

Official Product Page

    Hanbit Electronics Co., Ltd.
Kondenshi Corp
Part No. KOM-5121
Description Power Monitor IC 电源监控器IC

File Size 232.88K  /  1 Page

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Amphenol Communications Solutions

Part No. 68655-121HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 21 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318in) Mating, 7.37 mm (0.29in) Tail.
Tech specs    

Official Product Page

    KOM-5121

KODENSHI KOREA CORP.
Part No. KOM-5121
Description Power Monitor IC

File Size 224.79K  /  1 Page

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Amphenol Communications Solutions

Part No. 10139085-121402LF
Description BergStak+™ 0.80mm Mezzanine Connector, Board To Board Connectors, 120 Positions, Dual Row, BTB Vertical Header, P1.
Tech specs    

Official Product Page

    BCM-5121

Bothhand USA, LP.
Part No. BCM-5121
Description COMMON MODE CHOKE

File Size 131.67K  /  1 Page

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Amphenol Communications Solutions

Part No. 10131935-121ULF
Description Minitek®, Board to Board, Receptacle, Surface Mount, Single row, 21 Positions, 2mm (0.079inch), Vertical.
Tech specs    

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    LC75757E LC75757W

SANYO[Sanyo Semicon Device]
Part No. LC75757E LC75757W
Description LC75757E/W

File Size 153.72K  /  17 Page

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Amphenol Communications Solutions

Part No. L17TF1512115
Description Dsub, Stamped Signal 3A, Straight PCB Press-Fit, 15 Pin, Bright Tin Shell+Grounding Dimples, 0.76um(30 in) Gold, M3 Threaded Boardlock with M3 Front Screwlock Installed
Tech specs    

Official Product Page

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