7584 pdf Datasheet P4 Part Num --- IC-ON-LINE


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7584 Datasheet PDF File

For 7584 Found Datasheets File :: 53+ Page :: | 1 | 2 | 3 | <4> | 5 | 6 |

					Intersil Corporation
Part No.	HUF75842P3
Description	43A, 150V, 0.042 Ohm, N-Channel,UltraFET Power MOSFET(43A, 150V, 0.042Ω N沟道2.5V专用功率MOS场效应管)
File Size	122.25K / 9 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	75844-108-72LF
Description	BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 72 Positions, 2.54mm (0.100in) Pitch.
Tech specs				Official Product Page

HUA FENG CIRCUIT

					Molex Electronics Ltd.
Part No.	87758-4017 0877584017
Description	2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 40 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 40 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
File Size	170.76K / 4 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	75844-379-26LF
Description	BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 26 Positions, 2.54mm (0.100in) Pitch.
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	87758-4016 0877584016
Description	2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 40 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 40 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
File Size	170.71K / 4 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	75844-129-14LF
Description	BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 14 Positions, 2.54mm (0.100in) Pitch.
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	0877584816 87758-4816
Description	2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 48 Circuits, 0.38μm(15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free 2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 48 Circuits, 0.38μm(15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
File Size	170.71K / 4 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	75844-156-40LF
Description	BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 40 Positions, 2.54mm (0.100in) Pitch.
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	0877584850 87758-4850
Description	2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 48 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray Packaging, Lead-free
File Size	135.77K / 4 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	75844-182-08LF
Description	BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 8 Positions, 2.54mm (0.100in) Pitch.
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	0877584650 87758-4650
Description	2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 46 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray Packaging, Lead-free
File Size	135.77K / 4 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	75844-156-20LF
Description	BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 20 Positions, 2.54mm (0.100in) Pitch.
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	0877584617 87758-4617
Description	2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 46 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free 2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 46 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
File Size	170.70K / 4 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	75844-694-20LF
Description	BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 20 Positions, 2.54mm (0.100in) Pitch.
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	0877584616 87758-4616
Description	2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 46 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free 2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 46 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
File Size	170.71K / 4 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	75844-148-14LF
Description	BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 14 Positions, 2.54mm (0.100in) Pitch.
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	0877584817 87758-4817
Description	2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 48 Circuits 2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 48 Circuits
File Size	170.70K / 4 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	75844-127-20LF
Description	BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 20 Positions, 2.54mm (0.100in) Pitch.
Tech specs				Official Product Page

					OKI[OKI electronic componets]
Part No.	MSM7584CTS-K MSM7584C
Description	pi /4 Shift QPSK MODEM/ADPCM CODEC
File Size	300.57K / 57 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	75844-120R10LF
Description	BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 10 Positions, 2.54mm (0.100in) Pitch.
Tech specs				Official Product Page

For 7584 Found Datasheets File :: 53+ Page :: | 1 | 2 | 3 | <4> | 5 | 6 |

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